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  • Articles: DFG German National Licenses  (3)
  • 1980-1984  (3)
  • Chemistry  (3)
  • Pseudomonas fluorescence
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  • Articles: DFG German National Licenses  (3)
Material
Years
Year
  • 1
    Electronic Resource
    Electronic Resource
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Applied Polymer Science 29 (1984), S. 1241-1248 
    ISSN: 0021-8995
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Measurements of birefringence during stress-relaxation and recovery have been recorded for examples of an epoxy resin cured at three different temperatures. Birefringence remained constant during stress-relaxation even after prolonged testing during which the stress fell considerably. The stress sensitivity was found to be the same on both loading and unloading so that, immediately after unloading, the birefringence was different to that prior to the stress-relaxation test. This residual change began to decay after a prolonged period free from applied stress. No significant differences were noted in the birefringence measurements made on samples cured at different temperatures, but, when the stress-relaxation data were analyzed by the procedure of Kubát and Rigdahl, marked differences appeared.
    Additional Material: 8 Ill.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Applied Polymer Science 29 (1984), S. 2155-2161 
    ISSN: 0021-8995
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Curing stresses in sheets of an epoxy polymer cured at 80°C, 120°C, and 135°C have been determined using the layer removal procedure. Tensile stresses were found to be present in the interior and compressive stresses near to the surface in all samples. Very low stresses were found to be present in material cured at 80°C, with a maximum compressive stress level close to 0.5 MN/m2 and a maximum tensile stress close to 0.25 MN/m2. Higher stress magnitudes were obtained when using higher curing temperatures, with values of more than 1 MN/m2 (compressive) and 0.6 MN/m2 (tensile) recorded for specimens cured at 135°C.
    Additional Material: 3 Ill.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
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  • 3
    Electronic Resource
    Electronic Resource
    Weinheim : Wiley-Blackwell
    Acta Polymerica 35 (1984), S. 667-668 
    ISSN: 0323-7648
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Physics
    Additional Material: 3 Ill.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
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