ISSN:
1432-1858
Source:
Springer Online Journal Archives 1860-2000
Topics:
Electrical Engineering, Measurement and Control Technology
,
Technology
Notes:
Abstract The fabrication of high aspect ratio microstructures using the X-ray lithography and electroplating step of the LIGA process requires, that the metal layer on the substrate (plating base) enables a flawless resist adhesion and provides a high conductivity for the following electroplating process. In addition, a flawless metal adhesion after electroplating has to be ensured. Typically metal layers of titanium, but also of copper and gold are used. In case of higher structures, fluorescence radiation generated in the metal layer during exposure reduces the bond strength between the resist and the adhesion layer [7]. Since the fluorescence probability decreases with a decreasing atomic number, the suitability of conductive carbon as the plating base was investigated and compared to results achieved with titanium. The resist adhesion was increased tremendously on the carbon layer but the metal adhesion is insufficient. Therefore, platinum islands were deposited on the conductive carbon to facilitate good metal adhesion. The resulting resist adhesion was still superior compared to titanium. In addition, metal adhesion was achieved on these layers.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/s005429900035
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