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  • 1995-1999  (2)
  • 1997  (2)
  • Multichip Module test and diagnosis  (1)
  • Shear Bending  (1)
  • 1
    Electronic Resource
    Electronic Resource
    Springer
    Archive of applied mechanics 67 (1997), S. 179-190 
    ISSN: 1432-0681
    Keywords: Key words Curved beams ; Shear Bending
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Summary  This paper presents the exact relationships between the deflections and stress resultants of Timoshenko curved beams and that of the corresponding Euler-Bernoulli curved beams. The curved beams considered are of rectangular cross sections and constant radius of curvature. They may have any combinations of classical boundary conditions, and are subjected to any loading distribution that acts normal to the curved beam centreline. These relationships allow engineering designers to directly obtain the bending solutions of Timoshenko curved beams from the familiar Euler-Bernoulli solutions without having to perform the more complicated shear deformation analysis.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
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  • 2
    Electronic Resource
    Electronic Resource
    Springer
    Journal of electronic testing 10 (1997), S. 127-136 
    ISSN: 1573-0727
    Keywords: Multichip Module test and diagnosis ; system diagnosis ; built-in self-test ; signature analysis
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology
    Notes: Abstract A system diagnosis technique for multichip module (MCM) ispresented. The proposed technique uses built-in probes for monitoringinternal responses and, with a signature analysis scheme based onerror correcting codes, identifies the probes where erroneous test responses have been detected. Conceptsfrom system diagnosis is used in conjunction withsignature analysis in developing the proposed MCM diagnosistechnique, where the resulting patterns of the faulty probes are usedin the identification of the faulty submodules (dies). The proposedtechnique offers a diagnostic capability in system functional test.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
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