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  • 1995-1999  (2)
  • 1998  (2)
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  • 1995-1999  (2)
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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 84 (1998), S. 2459-2465 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Impurities in MeV-implanted and annealed silicon may be trapped at interstitial defects near the projected ion range, Rp, and also at vacancy-related defects at approximately Rp/2. We have investigated the temperature dependence of impurity trapping at these secondary defects, which were preformed by annealing at 900 °C. The binding energies of Fe, Ni, and Cu are greater at the vacancy-related defects than at extrinsic dislocation loops. During subsequent processing at temperatures up to 900 °C, the amount of these impurities trapped at Rp/2 increases with decreasing temperature while the amount trapped at Rp decreases, with most of the trapped metals located at Rp/2 in samples processed at temperatures (approximately-less-than) 700 °C. However, intrinsic oxygen is trapped at both types of defects; this appears to have little effect on the trapping of metallic impurities at extrinsic dislocations, but may inhibit or completely suppress the trapping at vacancy-related defects. © 1998 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 73 (1998), S. 1206-1208 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The redistribution of iron implanted into the oxide layer of silicon-on-insulator structures has been measured using the secondary ion mass spectroscopy technique after annealing at 900–1050 °C. Iron diffusion has been found to be much faster in the oxide prepared by the separation-byimplantation-of-oxygen (SIMOX) procedure compared to the thermally grown oxide in the bonded and etched-back structures. In the latter case, the Fe diffusivity exhibits a thermal activation with an energy of 2.8 eV, confirming the literature data on silica glass. In the SIMOX oxide, the diffusivity depends only weakly on temperature, indicative of an essentially activation-free diffusion mechanism. Gettering of Fe at below-the-buried-oxide defects in SIMOX wafers has been observed. No iron segregation has been detected at the SiO2–Si interfaces. © 1998 American Institute of Physics.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
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