ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Today, reflow soldering is a commonly used technique to establish large-area joints inpower electronics modules. These joints are needed to attach large-area (〉1 cm2) powersemiconductor chips to the substrate, e.g., a direct-bond copper substrate, and the multichip modulesubstrate to a copper base plate for heat spreading. Thermal performance, specifically thermalconductivity and thermomechanical reliability, of these large-area joints are critical to the electricalperformance and lifetime of the power modules. Soft solder alloys, including the lead-tin eutecticand lead-free alternatives, have low thermal conductivities and are highly susceptible to fatiguefailure. As demands mount for higher power density, higher junction temperature, and longerlifetime out of the power modules, reliance on solder-based joining is becoming a barrier for furtheradvancement in power electronics systems. Recently, we successfully demonstrated lowtemperaturesintering of nanoscale silver paste as a lead-free solution for achieving highperformance,high-reliability, and high-temperature interconnection of small devices (〈0.09 cm2).In this paper, we report the results of our study to extend the low-temperature sintering technique tolarge-area joints. The study involved redesigning the organic and inorganic components of thenanoscale silver paste, analyzing the burnout kinetics of the various organic species sandwichedbetween large-area plates, and developing desirable temperature-time profile to improve sinteringand bonding strength of the joints
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/55/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.353-358.2948.pdf
Permalink
