ISSN:
1662-9779
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Physics
Notes:
In this study, joining characteristics of dissimilar Ti and Cu metals have beeninvestigated, when using both an Ag-based eutectic alloy as a filler and an Ag layer present on Tibase metal as a diffusion barrier. The observed microstructures were classified into threecharacteristic types, depending on the presence of a Ag layer at the Ti interface, e.g. first, thesample retaining thick continuous intermetallic layers, e.g. Ti2Cu, TiCu, Ti3Cu4, Ti2Cu3, and TiCu4by a significant dissolution of the Ti atoms into the molten filler, in the absence of a Ag coatinglayer onto the Ti base metal, second, the sample with relatively thin Ti-Cu intermetallic layers bythe reduced reaction of Ti with Cu due to a prominent decrease in the Ti dissolution, owing to therole of the Ag coating layer as a diffusion barrier, and finally, the sample without any brittle Ti-Cuintermetallics in the joint by a complete suppression of both the dissolution of the Ti atoms and itsreaction with the Cu elements in the molten filler due to the presence of a Ag layer
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/24/transtech_doi~10.4028%252Fwww.scientific.net%252FSSP.135.135.pdf
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