ISSN:
1662-9779
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Physics
Notes:
The morphological evolution of intragranular voids induced by the surface drift-diffusionunder the action of capillary forces, electromigration (EM) forces, and thermal stress gradients(TSG) associated with steady state heat flow is investigated in passivated metallic thin films viacomputer simulation using the front-tracking method. As far as the device reliability is concerned,the most critical configuration for interconnect failure occurs even when thermal stresses are low ifthe normalized ratio of interconnect width to void radius is less than certain range of values (whichindicates the onset of heat flux crowding). This regime manifests itself by the formation of twosymmetrically disposed finger shape extrusions (pitchfork shape slits) on the upper and lowershoulders of the void surface on the windward side. The void growth (associated withsupersaturated vacancy condensation) on the other hand inhibits anode displacement but enhancescathode and shoulder slit velocities drastically, which causes lateral spreading
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/24/transtech_doi~10.4028%252Fwww.scientific.net%252FSSP.139.151.pdf
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