ISSN:
1432-0630
Source:
Springer Online Journal Archives 1860-2000
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
Abstract We have measured the stress distribution at He temperature on two epitaxial GaAs wafers which were compressed along one edge. The stress was determined non-destructively at different points on the wafer surface by using the line-splitting and the lineshifts of the photoluminescence spectra of the acceptor-bound excitons in comparison with calibration spectra at known uniaxial stress.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/BF00883669
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