ISSN:
1572-8943
Keywords:
adhesive
;
composition analysis
;
curing kinetics
;
DMA
;
DSC
;
TGA
;
thermal cure
;
thermoplastic/thermoset blend
Source:
Springer Online Journal Archives 1860-2000
Topics:
Chemistry and Pharmacology
Notes:
Abstract DSC, TGA and DMA thermal analysis techniques are used to characterize a complex adhesive blend. The chemical and thermomechanical property development shown to follow a two-stage process. Beneficial synergy between these analysis tools is demonstrated in this study.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1023/A:1010166230313
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