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  • 2005-2009  (3)
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  • 1
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 550 (July 2007), p. 141-148 
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Tensile tests have been carried out in the rolling and transverse directions of 'interstitialfree'(IF) steel cold rolled to a strain of εh= -0.18. Tests in the transverse direction showed thecharacteristic features of the orthogonal strain path change effect, with an initially increased flowstress- compared to tests in the rolling direction- followed by a transient regime of very low strainhardening. Tests were also carried out following recovery annealing of the prestrained sheet at500°C and 600°C. Static recovery had a marked effect on the strain-induced anisotropy, but thiswas not eliminated even when the cell structure generated by prestraining haD condensed to oneconsisting of low-angle boundaries. This supports the view that the length scale, with respect toactive slip systems, between boundary obstacles is a significant factor in the orthogonal path changeeffect
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 558-559 (Oct. 2007), p. 449-456 
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Copper, Cu-2%Sn and Cu-4.5%Sn alloys have been deformed in plane straincompression at temperatures up to 700oC and the evolution of the microstructures and texturesdetermined by high resolution EBSD. The effect of the solute is to raise the temperature at whichdynamic recrystallization occurs and to significantly reduce the size of the dynamicallyrecrystallized grains. In all the materials, there is a small increase in the cube texture component ondynamic recrystallization. The boundary bulges which precede recrystallization are different in thecopper and Cu-Sn alloys, although in both materials there is evidence that local deformation in theboundary regions plays a significant role in dynamic recrystallization
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 550 (July 2007), p. 441-446 
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Recrystallization phenomena in an interstitial free (IF) steel have been investigated byin-situ annealing in the SEM, combined with Electron Back Scattered Diffraction (EBSD) mapping.Sequential recrystallization phenomena, such as initiation and growth of new grains, are clearlydistinguished by EBSD mapping at temperatures of up to 1070K. More than 70% of the recrystallizedgrains are of {111}〈121〉, {111}〈123〉 and {111}〈110〉 orientation. It is found that manyrecrystallized grains are formed from {111}〈123〉 deformed grains at the beginning ofrecrystallization. It is observed that some of α-fibre (RD//〈110〉) orientations have difficulty inrecrystallization compared to γ–fibre deformed grains. In particular, many grains of {001}〈110〉orientation remain un-recrystallized even after holding for 65 minutes at 1050K
    Type of Medium: Electronic Resource
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