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  • 2005-2009  (5)
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  • 2005-2009  (5)
Year
  • 1
    Electronic Resource
    Electronic Resource
    Experimental Study on Green Cutting with Water Vapor as Coolant and Lubricant (2006)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 315-316 (July 2006), p. 45-50 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Green cutting has become focus of attention in ecological and environmental protection.Water vapor is cheap, pollution-free and eco-friendly. Therefore water vapor is a good andeconomical coolant and lubricant. Water vapor generator and vapor feeding system are developed togenerate and feed water vapor. The lubricating method of water vapor is that the water vapor jet flowis directly jetted on the cutting zone and it cancels the fluid phase penetrating the capillaries in cuttingzone. So it increases the time reserve of penetration and improves the property of penetration andlubricating effect. In order to find the influenced disciplinarians on lubricating effect with nozzlediameter, the parameters of water vapor jet flow and cooling distance (the distance between nozzleand cutting zone), experiments are carried out which hard alloy YT15 (P10 type in ISO) tool is usedin cutting C45 steel. Experimental results show that the cutting force becomes lowered and chipthickness becomes thinned with the nozzle diameter decreasing. With the saturated vapor pressureincreasing and the cooling distance shortening, the cutting force is lowed and the chip thickness isthinned too. Therefore the application of water vapor as coolant and lubricant can realize the greencutting in industry
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/51/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.315-316.45.pdf
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    Paper (German National Licenses)
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  • 2
    Electronic Resource
    Electronic Resource
    The Investigations of Tool Wear and Wear Mechanism with Water Vapor as Coolants and Lubricants in Green Cutting (2007)
    s.l. ; Stafa-Zurich, Switzerland
    Applied mechanics and materials Vol. 10-12 (Dec. 2007), p. 913-917 
    Details
    ISSN: 1662-7482
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: In machining, coolants and lubricants improve machinability, increase productivity byreducing the tool wear and extend the tool life. However, the use of cutting fluid in metal workingmay seriously degrade the quality of environment. Green cutting is becoming increasingly morepopular due to concern regarding the safety of the environment and operator health. Theexperimental investigations were carried out with cemented carbide tool in turning ANSI 304stainless steel and applications of water vapor, CO2, O2 as coolants and lubricants. The applicationof water vapor as coolants and lubricants allowed extending tool life. The catalysis chemicalreaction have been generated between water molecules (H2O), oxygen atoms (O) of water vaporand fresh metal surface of tool-chip contact region, and multi-dimension metal oxidations which hasbeen formed in tool-chip contact zone weakened mutual action between tool bulk material and chip
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/38/transtech_doi~10.4028%252Fwww.scientific.net%252FAMM.10-12.913.pdf
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    Paper (German National Licenses)
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  • 3
    Electronic Resource
    Electronic Resource
    A Suspending Abrasives and Porous Pad Model for the Analysis of Lubrication in Chemical Mechanical Polishing (2006)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 315-316 (July 2006), p. 775-778 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The lubrication properties of the slurry between the silicon wafer and the pad in chemicalmechanical polishing (CMP) are critical to the planarity of the silicon wafer. The effects of porous padand suspending abrasives on the slurry film beneath the wafer become more prominent as the size ofthe silicon wafer becomes bigger. In order to explore the effects of porous pad and suspendingabrasives on the lubrication properties of the slurry, a three-dimensional lubrication model based onthe micropolar fluid theory and Darcy’s law is developed. The effects of the nanometer abrasives andthe porosity of the pad on the lubrication of the slurry film between the silicon wafer and the pad arediscussed
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/51/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.315-316.775.pdf
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    Paper (German National Licenses)
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  • 4
    Electronic Resource
    Electronic Resource
    Effects of Suspending Abrasives on the Lubrication Properties of Slurry in Chemical Mechanical Polishing of Silicon Wafer (2006)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 304-305 (Feb. 2006), p. 359-363 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The lubrication properties of the slurry between the silicon wafer and the pad in chemical mechanical polishing (CMP) are critical to the planarity of the silicon wafer. Moreover, the suspending abrasives, which are contained in the slurry, have an extremely important influence on the lubrication properties of the slurry. In the CMP process of the large-sized silicon wafers, the influence of suspending abrasives on the slurry becomes more prominent. In order to explore the effects of suspending abrasives on the lubrication properties of the slurry under the light load conditions, a three-dimensional lubrication model based on the micro-polar fluid theory is developed. The effects of suspending abrasives on the fluid pressure acting on the wafer and the distribution of the slurry film between the silicon wafer and the pad are discussed
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/50/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.304-305.359.pdf
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    Paper (German National Licenses)
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  • 5
    Electronic Resource
    Electronic Resource
    Research on Cooling Action and Simulation of Temperature Distribution with Water Vapor as Coolants and Lubricants in Green Cutting (2007)
    s.l. ; Stafa-Zurich, Switzerland
    Applied mechanics and materials Vol. 10-12 (Dec. 2007), p. 276-280 
    Details
    ISSN: 1662-7482
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Water vapor is a good, pollution-free and economical coolants and lubricants in greenmachining. In order to research the cutting temperature distributions with water vapor as coolantsand lubricants in machining, the experiments conducted under the conditions of water vapor ascoolants and lubricants and dry cutting. The cutting temperatures are studied by metal cuttingtheory, and then by employing the finite element method (FEM), the temperature distribution ofcutting region is simulated with application of water vapor as coolants and lubricants and drycutting conditions. The results show that the water vapor jet flow has high force-convection heattransfer coefficient and directly cooling action to reduce cutting temperature, and the stress, thelength of tool-chip interface are reduced with application of water vapor lubrication. So that thecutting thermal is decreased and water vapor has indirect cooling action. Under the conditions ofindirect and direct cooling action, the cutting temperature is reduced obviously with application ofwater vapor as coolants and lubricants
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/38/transtech_doi~10.4028%252Fwww.scientific.net%252FAMM.10-12.276.pdf
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    Paper (German National Licenses)
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