ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
In this paper we will discuss the impact of residual stresses on the reliability of microelectroniccomponents and the materials used therein. The following issues will be particularly emphasized:First, the tendency toward delamination and subsequent cracking along interfaces, such as betweensilicon dies, organic substrates, glues, and underfill material; second, the fatigue of electrolyticallydeposited copper vias within the substrate and FR4 board material; third, the accumulation ofirreversibly accumulated plastic (creep) strain in lead containing as well as leadfree solders; the microstructuralchange observed during thermo-mechanical use within the bulk as well as at the interface ofsolder interconnects. We will present state-of-the-art numerical techniques that allow to quantify thedevelopment of stresses and strains within the aforementioned materials, mostly by finite elementanalysis, as well as the coupling between local stresses and diffusion processes, which is theoreticallybased on phase field models. Further emphasis is put on proper knowledge and determination of theinherent material parameters and how theoretical predictions can be linked to and validated by experimentalobservations and facts
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/13/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.524-525.1.pdf
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