ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
An Al foil of 25 µm thickness was used to produce a Ni/Al/Ni interconnection underisothermal conditions at 680°C. After dissolution of the Al filler metal in the Ni substrate, and Ni from the substrate in the Al liquid foil, a solidification process occurred. First of all, the solidification was stopped just at the disappearance of the Al liquid metal, but also at different steps of the progress of solidification. Sub-layers of the two phases Al〈sub〉3〈/sub〉Ni〈sub〉2〈/sub〉 and Al〈sub〉3〈/sub〉Ni were revealed within the frozen joints. A solidification - segregation model was developed to describe the formation of the sub-layers of both mentioned phases. The model is able to predict solute segregation profiles across the sub-layers of the Ni/Al/Ni interconnection, taking into account a superposition of some phenomena like partitioning, back-diffusion into the solid and peritectic reactions. The value of the diffusion coefficient into the solid for the Al〈sub〉3〈/sub〉Ni〈sub〉2〈/sub〉 phase formation in the presence of the liquid is also estimated
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/12/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.508.385.pdf
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