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Treatment of HTLV-I-associated myelopathy with high-dose intravenous gammaglobulin (1991)

Kuroda, Y. ; Takashima, H. ; Ikeda, A. ; [et al.]

Springer

Journal of neurology 238 (1991), S. 309-314

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ISSN: 1432-1459

Keywords: Human T-lymphotropic virustype I ; HTLV-I-associated myelopathy ; Tropical spastic paraparesis ; Gammaglobulin ; Therapy

Source: Springer Online Journal Archives 1860-2000

Topics: Medicine

Notes: Summary Fourteen patients with HTLV-1-associated myelopathy were treated with high-dose intravenous gammaglobulin (IVGG). Ten received 10 g/day of IVGG and 4 received 400 mg/kg of body-weight/day of IVGG for 5 consecutive days. Improvement of spastic paraparesis was observed in 10 within 7 days of the commencement of IVGG. The therapeutic effects were sustained for more than 3 weeks in some patients. There were no side effects. Analysis of factors of relevance to the clinical improvement with IVGG showed that the beneficial response was preferentially found in patients having a high CSF titre of anti-HTLV-I antibodies, a high CSF IgG level and a marked brain MRI abnormality.

Type of Medium: Electronic Resource

URL: http://dx.doi.org/10.1007/BF00315327

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Ester-type photosensitive polyimide precursor with low thermal expansion coefficient (1992)

Matsuoka, Y. ; Yokota, K. ; Ogitani, S. ; [et al.]

Stamford, Conn. [u.a.] : Wiley-Blackwell

Polymer Engineering and Science 32 (1992), S. 1618-1622

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ISSN: 0032-3888

Keywords: Chemistry ; Chemical Engineering

Source: Wiley InterScience Backfile Collection 1832-2000

Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics

Notes: For an ester-type photosensitive polyimide precursor of low thermal expansion coefficient, the oxygen concentration in the curing process and the molecular weight of the polyimide precursor were found to control the properties of the polyimide. The effects of these factors on the thermal expansion coefficient, tensile strength, and modulus of polyimide film were investigated. Based on these results, a photosensitive polyimide with low thermal expansion coefficient, called the PIMEL TL-series, was developed. Crack and delamination free multilayers were successfully achieved using this newly developed product.

Additional Material: 9 Ill.