ISSN:
1573-4862
Keywords:
Ultrasonics
;
solid-state welding
;
pattern recognition
;
feature extraction
Source:
Springer Online Journal Archives 1860-2000
Topics:
Electrical Engineering, Measurement and Control Technology
,
Mathematics
Notes:
Abstract Ultrasonic techniques for evaluating the quality of solid-state weld interfaces have been investigated over the past several years. Promising results have been obtained on a variety of solid-state welds by extracting features from the ultrasonic wave forms and applying pattern recognition algorithms to separate acceptable from unacceptable welds. The general conclusion is that the ultrasonic features most sensitive to interfacial bonding are those dependent on high frequencies. However, no single feature has been discovered that is adequate to yield separation of good vs. poor welds, since the microstructural response is also frequency dependent. Given the increase in sensitivity and resolution with high-frequency ultrasonic evaluation, selected specimens have been examined with acoustic microscopy. These specially prepared samples were inspected with focused transducers at frequencies in the 35–75 MHz range. The reflections observed indicated bond quality to vary in discrete regions with good and poor regions distributed across the diameter. Corresponding variations in the degree of bonding have been observed on the fracture surfaces of mechanically-tested specimens. The development of both low- and high-frequency acoustic microscopy has led to the possibility of sensing and imaging subtle changes in the reflection coefficient of the bond line. These acoustic images will improve our understanding of the mechanisms involved in evaluating solid-state bonds.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/BF00566005
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