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  • 1985-1989  (2)
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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 64 (1988), S. 1494-1498 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The copper-catalyzed fluorination of silicon is first order in [F2] and in [Cu]s until the coverage reaches ∼4 monolayers. Above ∼4 monolayers the reaction rate is zero order in copper, suggesting a limited number of catalytically active Cu/Si sites. Copper islands form at high coverages, above saturation, and provide a reservoir of catalyst. The limited rate of surface diffusion of copper leads to anisotropic etching and feature size-dependent etch depths. The copper compounds, CuF2 and CuO, and copper silicides, Cu5Si and Cu3Si, all catalyzed the F2-Si reaction which suggests that they are all converted to the same active species. The results can be explained by mechanisms involving copper fluorides or copper silicides as active intermediates.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 62 (1987), S. 1049-1053 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Traces of copper and silver are shown to accelerate the etching of silicon by molecular fluorine. Copper residue formed by aqueous HF etching of sputter-deposited aluminum (0.5% Cu) produces a 100-fold increase in the etching rate of an underlying (100) silicon, compared to unmetallized samples, at temperatures above 80 °C. Above 180 °C, F2 exhibits a higher absolute etch rate than equivalent concentrations of fluorine atoms. The temperature dependence of the reaction is interpreted in terms of a Cu-CuF(x=1,2) catalytic cycle in which CuF(x=1,2) is the active intermediate. Preliminary results for other gases and metals are presented, and the origin of discrepancies in published rate data for the F2/Si reaction are discussed.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
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