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  • 1985-1989  (2)
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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 65 (1989), S. 210-214 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Silicon dioxide films are sputter deposited on polycrystalline silicon (polysilicon) in an oxygen-argon atmosphere at 200 °C. Electrical conduction and breakdown are measured at various gate fields and temperatures. In addition to the Fowler–Nordheim tunneling current reported for thermal oxide, the sputter-deposited films have another, newly identified high-activation-energy current as electrical conduction mechanisms. The high-activation-energy current contribution to the total current is considerably reduced by increasing the oxygen mixing ratio and/or by decreasing the sputtering gas pressure, resulting in a considerable total current reduction. High-activation-energy current contributes little to the triggering of breakdown, unlike Fowler–Nordheim tunneling injections. In contrast to polysilicon thermal oxide, sputter-deposited films on polysilicon have no observable field enhancement in Fowler–Nordheim tunneling current, which indicates smooth surfaces. Thus, electrical properties in oxygen-argon sputter-deposited films on polysilicon are explained by high-activation-energy current and Fowler–Nordheim tunneling current.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 62 (1987), S. 2360-2363 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Silicon dioxide films, 8–100 nm thick, are sputter deposited in an oxygen-argon atmosphere onto a silicon substrate at 200 °C. Electrical conduction and dielectric breakdown in oxygen-argon sputter-deposited film are measured using metal-oxide-semiconductor capacitors and compared with those in thermal dioxide film. Moreover, their mechanisms are investigated. Thin oxygen-argon sputter-deposited film is found to have the same low electrical conduction and high dielectric breakdown as thermal dioxide film. Electrical conduction through oxygen-argon sputter-deposited film shows small temperature dependence and Fowler–Nordheim characteristics. For a wide range of film thickness, the breakdown field in oxygen-argon sputter-deposited film correlates well with that in thermal dioxide film and with the impact ionization/recombination model. Thus, the electrical conduction mechanism through oxygen-argon sputter-deposited silicon dioxide film is Fowler–Nordheim tunneling, and dielectric breakdown is explained by the impact ionization/recombination model.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
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