ISSN:
0449-296X
Keywords:
Physics
;
Polymer and Materials Science
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
Notes:
The synthesis and polymerization of seven epoxy polymer precursors which contained the siloxane linkage in varying structural arrangements was carried out. The polymers prepared from such precursors have utility as embedding compounds for electrical circuits. Polymerization of these epoxy intermediates with siloxane-containing diamines resulted in solid, thermosetting materials for which dielectric data were obtained. Dielectric constants of 3.1 were measured at 1 keps for polymers prepared by polymerization of 1,9-bis[p-(2,3-epoxypropyl)phenyl]decamethylpentasiloxane with 1,3-bis(p-am-inophenoxy)tetramethyldisiloxane, whereas polymers derived from 1,4-bis{[p-(2,3-epoxypropyl)phenyldimethylsiloxy]dimethylsilyl}benzene and the same diamine were characterized by slightly higher dielectric constants and a high degree of toughness, being nonbrittle at -50°C.
Additional Material:
7 Ill.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/pol.1969.150070407
Permalink
