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  • 73.30+y  (1)
  • 81.15.-z  (1)
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  • 1
    Electronic Resource
    Electronic Resource
    Springer
    Applied physics 35 (1984), S. 47-50 
    ISSN: 1432-0630
    Keywords: 68.55+b ; 73.30+y
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Abstract Three kinds of samples were used to form Co suicides by thermal annealing: firstly, a Co film of about 370 Å thick, evaporated on a (100) single crystal Si (Si c /Co); secondly, an evaporated boron-containing Si (Si e (B)) layer on the top of the first sample (Si c /Co/Si e (B)). The last sample is in the Co film of the first sample we deposited a Sie(B) layer (Si c /Co/Si e (B)/Co). A laterally uniform CoSi2 layer can be formed from the second and the third samples by annealing at 450 °C. In the first sample, the CoSi2 can be formed only at temperatures above 500 °C and the disilicide is laterally less uniform than in the second and third samples. The Schottky barrier heights of the three samples derived from the forward and reverse I–V characteristics show that the barrier height is 0.01–0.02eV higher in the uniform case than in the nonuniform case.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Springer
    Applied physics 45 (1988), S. 265-270 
    ISSN: 1432-0630
    Keywords: 81.15.-z ; 81.60.Bb
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Abstract Molybdenum oxide (Mo1−xOx) films were prepared by reactive rf sputtering of a Mo target in O2/Ar plasma. The dependence of film properties on various sputtering parameters is investigated. The atomic percentage of oxygen (x) in the Mo1−xOx films decreases with sputtering power and increases with the partial pressure of oxygen. Mo1−xOx films that exhibit metallic conductivities can be obtained over a wide range of sputtering conditions. The intrinsic film stress of conducting Mo1−xOx is compressive. Such M1−xOx films were shown by backscattering spectrometry to be excellent diffusion barriers between Al and Si up to 600 °C annealing for 30 min.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
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