ISSN:
1432-0630
Keywords:
42.60.−v
;
82.50.−m
Source:
Springer Online Journal Archives 1860-2000
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
Abstract Organic polymer (PES: PolyEther Sulphone and PEEK: PolyEther Ether Ketone) ablation with oscillation-line selected TEA CO2 lasers is successfully demonstrated. With different irradiation conditions the ablative etch-rate slopes were varied, which means that the ablation process is dependent on the ablation conditions such as incident laser intensity and ambient gas. In perforation processing of the PEEK film, the TEA CO2 laser had a higher etch rate of 42 μm/pulse at a fluence of 70 J/cm2 in vacuum than the XeCl laser.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/BF00332440
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