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  • Chemical Engineering  (1)
  • 1
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 35 (1995), S. 1353-1358 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: A bismaleimide (BMI) resin was added to an epoxy system composed of N,N′-tetraglycidyldiaminodiphenyl methane (TGDDM) and diaminodiphenyl methane (DDM). Cure behavior of the BMI modified epoxy resins was studied by a dynamic differential scanning calorimetry (DSC) method. Dynamic DSC thermograms of the BMI modified epoxy resins indicated unimodal reaction exothermic peaks. The overall heat of reaction per unit mass decreased with BMI composition. The residual heat of reactions of the epoxy blends cured at 180°C for 3 h increased with BMI composition. Thermal stability of the epoxy system improved by incorporating BMI resin. Flexural strength and modulus increased with BMI composition.
    Additional Material: 10 Ill.
    Type of Medium: Electronic Resource
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