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  • 1
    Electronic Resource
    Electronic Resource
    Thermal Analysis Characterization of a Commercial Thermoplastic/Thermoset Adhesive (2000)
    Springer
    Journal of thermal analysis and calorimetry 59 (2000), S. 559-570 
    Details
    ISSN: 1572-8943
    Keywords: adhesive ; composition analysis ; curing kinetics ; DMA ; DSC ; TGA ; thermal cure ; thermoplastic/thermoset blend
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology
    Notes: Abstract DSC, TGA and DMA thermal analysis techniques are used to characterize a complex adhesive blend. The chemical and thermomechanical property development shown to follow a two-stage process. Beneficial synergy between these analysis tools is demonstrated in this study.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1023/A:1010166230313
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    Paper (German National Licenses)
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  • 2
    Electronic Resource
    Electronic Resource
    Thermomechanical properties of 1C molding compoundsPresented at the Annual Meeting of American Institute of Chemical Engineers in San Francisco, California on November 6, 1989. (1990)
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 30 (1990), S. 609-617 
    Details
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Eight commercial semiconductor grade epoxy compounds that are used to encapsulate 1C (integrated circuit) devices have been evaluated for their ability to minimize the development of thermal stresses which can cause failure during device temperature cycling. Thermal expansion, dynamic modulus and adhesion studies are used to describe the mechanical interaction between the plastic package and the silicon device it surrounds. A “figure of merit” is defined for the development of stress on the 1C device as it is cooled after the packaging process. The stress is shown to be proportional to the product of three terms: (αp-αs) Ep (Tanch-T) where αp and αs are the expansion coefficients for the plastic and silicon, respectively, Ep is the modulus of the epoxy and Tanch is the temperature at which the epoxy becomes anchored to the silicon device during transfer molding. In addition, the importance of good adhesion between the epoxy encapsulant and the silicon device to prevent package cracking has been demonstrated by finite element analysis and a novel adhesion test.
    Additional Material: 16 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pen.760301008
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    Paper (German National Licenses)
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  • 3
    Electronic Resource
    Electronic Resource
    The effects of cure temperature on the thermomechanical properties of UV curable coatings (1989)
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 29 (1989), S. 1165-1168 
    Details
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: A method is presented to study the mechanical behavior of soft, UV curable coating material as a function of temperature of the prepolymer at cure. For such materials, the crosslink density (hence, equilibrium modulus) is found to decrease with increasing cure temperature. The three primary coatings are: a polyurethane acrylate with a nominal equilibrium tensile modulus of 200 psi, a polyurethane acrylate with a nominal equilibrium modulus of 1200 psi, and a non-urethane acrylate with a nominal equilibrium tensile modulus of 60 psi.
    Additional Material: 9 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pen.760291704
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  • 4
    Electronic Resource
    Electronic Resource
    Time temperature dependence of dual coated lightguide pullout measurements (1989)
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 29 (1989), S. 1169-1171 
    Details
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The strength of the bond between primary coating and glass for a dual coated lightguide may be judged by fixing the coating to a substrate and pulling the glass out. The values obtained from such measurements are shown to exhibit a temperature and rate dependence similar to the mechanical properties of the primary coating for a given coating system. Here we combined temperature and rate data for a universal description of the coating to glass adhesion for a dual coating system.
    Additional Material: 7 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pen.760291705
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    Paper (German National Licenses)
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  • 5
    Electronic Resource
    Electronic Resource
    Mechanical relaxation of flame retardant polycarbonate using the cole-cole method (1985)
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 25 (1985), S. 105-112 
    Details
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The frequency dependence of the complex-shear modulus of a nonbrominated flame-retardant polycarbonate has been successfully represented from 1 hertz (hz) to 1 gigahertz (ghz) at 190°C using a mechanical analog of the Cole-Cole dielectric analysis. Two sets of retardation times were required centered about 74 msec and 16 μsec. The β value for the short time response was 0.83 and for the longer time response was 0.58. The values of JoN determined from the common point at which the terminal-zone arc and the transition-zone arc touch the Jc″ = 0 axis yields an entanglement molecular weight, Me, of 1470 g/mole.
    Additional Material: 10 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pen.760250208
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    Paper (German National Licenses)
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