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  • 1
    Electronic Resource
    Electronic Resource
    New York, NY [u.a.] : Wiley-Blackwell
    Advanced Materials for Optics and Electronics 5 (1995), S. 79-86 
    ISSN: 1057-9257
    Keywords: CMT ; composition ; AES ; Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Physics
    Notes: The width of the band gap in the ternary system CdxHgI-xTe (CMT) is a function of the value of x and the assessment of device structures requires reliable techniques for the measurement of x both laterally and with depth. This work describes the development of an Auger electron spectrometry (AES) method for the measurement of CMT composition depth profiles, based on measurement of the Cd/Te ratio along shallow-angle bevelled sections through epitaxial layers. Results are accurate to within 3% relative and the depth resolution (Δz = 2σ) is about 0.04 μm even through layer structures with a total thickness of about 20 μm. Techniques for making the bevel sections are described together with the AES measurement and calibration techniques. A composition depth profile is given for a heterostructure grown by metal organic vapour phase epitaxy (MOVPE), showing the interface width (Δz = 2σ) at the composition change to be 0.3 μm. The CdTe/CMT interface widths in material grown by liquid phase epitaxy (LPE), MOVPE and molecular beam epitaxy (MBE) are shown to be highly dependent on growth temperature, with widths of 1.5, 0.2 and ≤ 0.04 μm respectively.
    Additional Material: 8 Ill.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 2 (1980), S. 91-95 
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: A quadrupole-based SIMS system has been used for the localized impurity analysis of GaAs. Spectral interferences are reduced by using a mass filtered primary ion beam and UHV conditions in the target chamber with energy discrimination of the secondary ions. Practical detection limits for 12 elements have been determined with samples calibrated by other methods. Detection limits for important impurities in GaAs range from 1014 atoms cm-3 for Cr and Mn to 1016 atoms cm-3 for Si, Zn and Sn. Depth profiles are presented which demonstrate that this detection capability is attained with micron thick layers. Confirmatory evidence of profile shapes and impurity concentrations has been obtained from independent electrical data.
    Additional Material: 3 Ill.
    Type of Medium: Electronic Resource
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  • 3
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: Details are given of a round robin depth profile comparison between 9 SIMS instruments (6 instrument types) applied to the analysis of an ion implanted Si(B) sample. It is shown that the shape of the boron profile is not sensitive to the sputter conditions employed and that the profile width data shows agreement to within 10% over the concentration range ∼1021 to 1015 cm-3 (104 to 0.02 ppma). This level of agreement is encouraging and gives confidence in the reliability of the SIMS method. Instrumental factors which control the profile dynamic range are shown to be dependent on the system configuration. With the quadrupole-based raster scanning instruments the quality of the primary beam is of importance, while with the imaging ion microscope systems, memory effects are significant. A dynamic range of ∼5 × 105 is obtained from both types of instrument. The analysis of identical samples prepared by ion implantation should enable other SIMS workers to check instrumental performance.
    Additional Material: 1 Ill.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 10 (1987), S. 332-337 
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: The analytical conditions necessary for the accurate measurement of shallow As implant profiles in crystalline Si have been critically evaluated. It is shown that near-normal oxygen bombardment (θ = 2°) gives rise to a drive-in of the As peak toegether with an enlarged exponential tail due to segregation processes associated with SiO2 formation in the near-surface region. At θ = 45°, both effects are greatly reduced. Thus, for enhanced depth resolution, it is essential to use oblique bombardment with low probe energies. Silicon sputter yield variations in the pre-equilibrium region are shown to be much smaller with θ = 45° and the differential peak shift amounts to only 0.6 nm per keV O+ compared with 3.0 nm at θ = 2°. The oblique sputter conditions do, however, lead to an increase in the thickness (w) of the pre-equilibrium region together with a loss in analytical sensitvity. The use of an oxygen jet is shown to reduce w to about 1 nm but gives rise to ‘chemically induced’ profile tailing with low energy (5 keV) As implants. Systematic measurements with different probe energies (1 and 2 keV O2+) show that As implants down to 10 keV are reliably profiled with θ = 45°. Comparison of our As range data with published Rutherford backscattering spectrometry values shows good agreement for the standard deviation while the mean projected range shows a systematic difference of ≃ 10%.
    Additional Material: 6 Ill.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 10 (1987), S. 338-342 
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: Multi-element (52Cr, 56Fe and 66Zn) implanted GaAs samples have been prepared specially for SIMS calibration. Absolute chemical measurements gave retained ion doses which agreed to within 12% of the nominal implanted dose (2.0 × 1014 atoms cm-2). Comparative SIMS depth profiles with five instruments gave Cr mode depth data which showed a variability of 5%. After data normalization to a common mode depth (168 nm) the shape of all profiles showed good agreement. SIMS anàlysis of similar samples containing lower dose implants (1.0 × 1013 atoms cm-2) showed that ∼50% of the Cr was contained in the near surface region (0-0.03 μm). This surface peak was not observed in profiles of samples which had been singly implanted with Cr. It is proposed that the Cr surface peak results from radiation enhanced out-diffusion initiated by the subsequent Fe implant. Whilst the high dose multi-implant samples showed a similar Cr surface accumulation, its magnitude in relation to the ion implanted dose, was smaller. These samples therefore form reliable calibration specimens for the simultaneous determination of the secondary ion responses of Cr, Fe and Zn in GaAs.
    Additional Material: 4 Ill.
    Type of Medium: Electronic Resource
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  • 6
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: Delta-doped structures represent a powerful class of test structures to investigate the experimental and fundamental factors limiting the depth resolution obtainable in SIMS sputter depth profiling.In this work, theoretical studies of the effects on the broadening of an Si delta spike in GaAs as a function of the energy (1.4-4.4 keV) and angle of incidence (2°, 45° and 60° off-normal) of the O2 sputter probe beam have been compared with recent experimental data. The theoretical calculations were carried out using the newly developed IMPETUS computer code, which simulates the depth profiling process by taking into account the combined effects of ballistic mixing (treating collisional mixing as a diffusion process), projectile incorporation into the matrix and sputtering. All of these are processes that always occur in any practical sputter depth profiling situation.The IMPETUS model can reproduce low-energy Si depth profiles with great accuracy by using the well-established TRIM calculated range, energy deposition and sputtering data and by making reasonable assumptions for the threshold energy for diffusion in addition to assuming a beam- and sputter statistics-induced surface microtopography, which is described by a Gaussian area versus height distribution having a standard deviation σ = 0.8 nm. Significantly, it is shown that the effects of these parameters on the shape of the sputter profile are largely independent, with σ (accounting for microroughness) mainly affecting the leading edge and the threshold energy (determining mixing processes) the trailing edge of the sputter profile. Good agreement on the energy dependence of the broadening is also obtained. The expected improvement in depth resolution with increasing off-normal bombardment angle is confirmed and can be quantified. The error in the experimental depth scale calibration based on a constant sputter rate, ignoring transient sputtering, is evaluated. Finally, the sputter depth profile observed for an Si delta spike in GaAs subjected to thermal annealing during growth by molecular beam epitaxy (MBE) can be reproduced accurately by considering diffusion broadening of the initial spike followed by a sputter profiling simulation.
    Additional Material: 5 Ill.
    Type of Medium: Electronic Resource
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  • 7
    Electronic Resource
    Electronic Resource
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 17 (1991), S. 190-196 
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: SIMS profiles of abrupt dopant distributions in semiconductor materials contain distortions introduced by the measurement process. In quantitative depth profile studies, it is important to determine and remove these errors.We have used the idea that a given input profile may be represented by a series of adjacent delta-doped planes. Given a knowledge of the SIMS obtained form one single plane (the resolution function), it is possible to simulate the expected SIMS profile form a given input profile by the convolution with the resolution function. Experimental data have been obtained form special samples of molecular beam epitaxial GaAs containing both delta-doped planes and uniformly doped regions (1-20 nm thick). The dopants investigated were Si, Be and Al. It is shown that the simulated and experimental profiles of the uniformly doped regions show good agreement, thus demonstrating the validity of the method. We also present results of the convolution of an input function having exponential decays on the leading and trailing edges, which show the corrections that should be made to experimentally determined profiles. Additional simulations have been made with Gaussian inputs, which are relevant in dopant diffusion studies, Silicon diffusion lengths as small as 4 atomic planes (1.1 nm) have been deduced.
    Additional Material: 10 Ill.
    Type of Medium: Electronic Resource
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  • 8
    Electronic Resource
    Electronic Resource
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 14 (1989), S. 307-314 
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: There is a developing interest in the use of atomic plane or δ-doping to produce narrow dopant spikes in molecular beam epitaxy GaAs. It is of importance to measure the dopant profile and to determine the growth conditions that minimize dopant spreading. We have used SIMS with low-energy oxygen bombardment to study the incorporation of silicon in such layers. To aid the optimization of the SIMS depth resolution, a special δ-doped layered structure has been produced by growth at 400°C. A critical evaluation of the SIMS data for these spikes shows that the profiles are broadened entirely by sputter-induced relocation effects rather than by thermal diffusion processes. The form of these δ-spike profiles therefore represents the SIMS resolution function with our specific experimental conditions. The absolute depth resolution (ΔZ) is found to be essentially constant for eroded depths up to ∼500 nm. With the lowest probe energy (0.7 keV per atom), giving a ΔZ of 2.7 nm, at least 68% of the Si is contained within nine atomic planes. Using appropriate sample handling, a detection limit of 1 × 1016 cm-3 Si is obtained after the erosion of only ∼ 15 nm. Analysis of structures grown at normal molecular beam epitaxy temperatures indicates that significant dopant spreading takes place during growth. It is shown that a knowledge of the resolution function enables the inherent SIMS broadening errors to be removed from these measurements. Thus, when the layer growth time is deliberately increased, the Si migrational process is dominated by Fickian diffusion, with the diffusion coefficient being equal to 3.8 × 10-17 cm2 s-1 at 553°C.
    Additional Material: 7 Ill.
    Type of Medium: Electronic Resource
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  • 9
    Electronic Resource
    Electronic Resource
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 17 (1991), S. 221-221 
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Type of Medium: Electronic Resource
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