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Excimer laser projection etching of copper foils in chlorine gas (1992)

Dyer, P. E. ; Greenough, R. D. ; Key, P. H.

New York, NY [u.a.] : Wiley-Blackwell

Advanced Materials for Optics and Electronics 1 (1992), S. 51-57

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Details

ISSN: 1057-9257

Keywords: Copper ; Etching ; Excimer ; Laser ; Chlorine ; Chemistry ; Polymer and Materials Science

Source: Wiley InterScience Backfile Collection 1832-2000

Topics: Electrical Engineering, Measurement and Control Technology , Physics

Notes: Low-fluence XeCl laser etching of copper foils in a chlorine environment has been studied. The etch rate is fluence-dependent in the range 0.05-1.0 J cm-2 and is governed by the growth characteristics of the chloride layer formed in the interpulse period. Projection etching with good pattern reproduction and resolution for high-aspect-ratio features is demonstrated.

Additional Material: 8 Ill.

Type of Medium: Electronic Resource

URL: http://dx.doi.org/10.1002/amo.860010202

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