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  • 1
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 30 (1990), S. 249-255 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The dynamic mechanical response of adhesively bonded metal beams has been examined over a broad temperature range using a dynamic mechanical thermal analyzer (DMTA). The measured dynamic mechanical response of the bonded beam contains rich information about the viscoelastic properties of the adhesive resin such as glass transition temperatures. The measured storage moduli and loss factors of the bonded beams are very sensitive to changes in the properties of adhesive induced by exposing the beam specimens to environmental attack. Dynamic mechanical responses associated with dry adhesive resin, water plasticized resin, and aggregated water were observed for an electro-galvanized steel/epoxy beam exposed to water. The effect of the presence of an interfacial accommodation zone (IAZ) between adhesive resin and metal substrate was also examined; measured properties were very sensitive to the presence of a low modulus IAZ. It was successfully demonstrated in this study that the DMTA testing of bonded beams is a potentially useful tool for studying dynamic performance and durability of automotive adhesive joints.
    Additional Material: 9 Ill.
    Type of Medium: Electronic Resource
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