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  • 1
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 17 (1977), S. 724-727 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The mechanistic origins of the post extrusion swelling phenomenon have been the subject of considerable debate. Conflicting theories have postulated that it is caused either by (1) deformations at the die entrance which are recovered upon die exit as a consequence of viscoelastic memory or (2) elastic enorgy, which is stored during capillary flow by the action of normal stress, and subsequently released upon die exit or by both (1) and (2). We have described these situations by mathematical models and show that the resulting equations are similar despite different origins. The difficulties in interpreting the results mechanistically are discussed. Empirically, the results can be described as being exponential in capillary residence irrespective of cause.
    Additional Material: 2 Ill.
    Type of Medium: Electronic Resource
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