Library

feed icon rss

Your email was sent successfully. Check your inbox.

An error occurred while sending the email. Please try again.

Proceed reservation?

Export
  • 1
    Electronic Resource
    Electronic Resource
    Springer
    Journal of thermal analysis and calorimetry 59 (2000), S. 559-570 
    ISSN: 1572-8943
    Keywords: adhesive ; composition analysis ; curing kinetics ; DMA ; DSC ; TGA ; thermal cure ; thermoplastic/thermoset blend
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology
    Notes: Abstract DSC, TGA and DMA thermal analysis techniques are used to characterize a complex adhesive blend. The chemical and thermomechanical property development shown to follow a two-stage process. Beneficial synergy between these analysis tools is demonstrated in this study.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
  • 2
    Electronic Resource
    Electronic Resource
    Chichester [u.a.] : Wiley-Blackwell
    International Journal for Numerical Methods in Engineering 15 (1980), S. 13-30 
    ISSN: 0029-5981
    Keywords: Engineering ; Engineering General
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Mathematics , Technology
    Notes: It is sometimes convenient to express a numerical algorithm in terms of a network model. The physical picture given can often help the engineer to visualize the properties of the method. In field problems, a lumped network model corresponds to a space discrete field while a transmission-line model corresponds to a field which is discrete in space and time. In this paper, the relationship is given between the lumped network models and transmission-line network models used in the steady-state solution of Maxwell's equations in two and three space dimensions. The use of dual networks is also discussed. An analysis is given for the velocity of waves travelling in any direction across the networks and this is used to compare the accuracy of the models. The use of diakoptics or substructures for the solution of large networks is outlined and this is illustrated by a compound two-dimensional example.
    Additional Material: 10 Ill.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
Close ⊗
This website uses cookies and the analysis tool Matomo. More information can be found here...