ISSN:
1572-8943
Keywords:
curing kinetics
;
DMA
;
electronic scrap
;
epoxy resin
;
TG-MS
;
thermal expansion
Source:
Springer Online Journal Archives 1860-2000
Topics:
Chemistry and Pharmacology
Notes:
Abstract With the aid of thermal analysis, epoxy (EP) resins have been characterized from the curing of the components all the way to disposal. The methods employed for the investigations were DSC, TMA, DMA, TG and TG-QMS. The experimental results obtained will be used here to demonstrate the typical possibilities offered by these methods for characterization of an epoxy resin from ‘cradle to grave’.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1023/A:1010164824506
Permalink