ISSN:
1572-8935
Schlagwort(e):
Sulfone-epoxy EBS
;
Silopane-epoxy ESBS
;
SEM/EDX
;
Compatibility
;
Immiscibility
Quelle:
Springer Online Journal Archives 1860-2000
Thema:
Chemie und Pharmazie
,
Maschinenbau
,
Physik
Notizen:
Abstract Epoxy resins of the EBS, a bis-p-phenol S modified diglycidyl ether of bis-p-phenol A and the ESBS, a siloxane modified EBS epoxy resin were prepared. Both structures of EBS and ESBS were elucidated with IR,1H NMR, and13C NMR. The near perpendicular comformation of two phenyl rings of sulfone has been introduced into the epoxy resins of EBS und ESBS for Me increase of Me Tg. Some curing and thermal characteristics of these modified EBS and ESBS epoxy resins were studied. The curing patterns of ESBS and ESBS indicated the similarity with that of the DGEBA epoxy resins. Tg measurements resulted an increasing order of We ESBS (Tg of 141 °C), EBS (Tg of 135 °C) and then followed by Epons 1004 (Tg of 104 °C), 1001 (Tg of 101 °C) and 828 (Tg of 100 °C) in samples tested under the same conditions. Thus the substantial improvement of the thermal stability of the modified epoxy resins was indicated. Compatibility characteristics of the EBS and ESBS as indicated by the SEM/EDS is that an ESBS up to 30 % of the siloxane content was found to be compatible but not miscible with the Epon, a phenolic epoxy resin of DGEBA.
Materialart:
Digitale Medien
URL:
http://dx.doi.org/10.1007/BF01374090
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