ISSN:
1042-7147
Keywords:
polyaniline
;
electrical conductivity
;
dodecylbenzene sulfonic acid
;
doping
;
Chemistry
;
Polymer and Materials Science
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Polyaniline-dodecylbenzene sulfonic acid (PAn-DBSA) complex was thermally treated and its conductivity and structure change were investigated. The conductivity increased linearly from 1.1 × 10-4 to 3.0 × 10-1 S/cm on thermal heating until 140°C, but decayed above 200°C. The increase was caused by an additional thermal doping resulting from an increasing mobility of undoped dopants. After the thermal doping, the formation of the layered structure of PAn-DBSA is made. The decrease was caused by the thermal decomposition of dopants. The conductivity changes at a high temperature was strongly dependent on the nature of the dopant. The results were confirmed by means of X-ray patterns and Fourier transform infrared spectra obtained in the heating and cooling processes of polyaniline.
Additional Material:
8 Ill.
Type of Medium:
Electronic Resource
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