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  • Polymer and Materials Science  (1)
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  • 1
    Electronic Resource
    Electronic Resource
    Weinheim : Wiley-Blackwell
    Macromolecular Chemistry and Physics 199 (1998), S. 489-511 
    ISSN: 1022-1352
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Physics
    Notes: We describe a general, linearized fracture mechanics analysis for studying the adhesive properties of elastic, low modulus materials. Several adhesion tests are described, but all involve an elastic material which is brought into contact with a rigid surface along an axis of radial symmetry. Relationships between the load, displacement, and radius of the circular contact area between the two materials are described. These relationships involve the elastic modulus of the compliant material, the energy release rate (or adhesion energy) and various parameters which characterize the geometry of interest. The ratio of the contact radius to the thickness of the elastic material is shown to be a particularly important parameter. After reviewing some general concepts relevant to the adhesion of soft polymeric materials, we describe the fracture mechanics analysis, and provide examples from our own work on the adhesion of elastomers, thermoreversible gels and pressure sensitive adhesives.
    Additional Material: 20 Ill.
    Type of Medium: Electronic Resource
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