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  • Ultrasonics  (1)
  • acoustics  (1)
  • 1
    Electronic Resource
    Electronic Resource
    Springer
    Journal of nondestructive evaluation 1 (1980), S. 235-247 
    ISSN: 1573-4862
    Keywords: Ultrasonics ; acoustic waves ; scattering ; diffraction ; defect characterization ; silicon nitride ; NDE
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Mathematics
    Notes: Abstract The scattering of acoustic waves by different types of spherical defects in a silicon nitride matrix is calculated by using Ying and Truell's scattering theory. The theoretical scattering results are interpreted using a ray tracing approach. Experiments were carried out at a high frequency (150–450 MHz) to characterize defects in silicon nitride. Time and space averaging, Wiener filtering, diffraction, and propagation loss corrections were used to remove the effect of the transducer response and propagation loss in the material from the scattered signal. Our experimental results indicate the presence of a new type of defect in silicon nitride. They give the type and size of voids, cracks, and Si inclusions in good agreement with measurements obtained after sectioning.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Springer
    Journal of nondestructive evaluation 2 (1981), S. 219-229 
    ISSN: 1573-4862
    Keywords: acoustics ; surface acoustic waves ; Rayleigh waves ; ceramics ; surface cracks ; residual stresses ; crack extension ; NDE
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Mathematics
    Notes: Abstract An investigation of scattering from surface cracks has been conducted. In particular, the change in the reflection coefficient of a Rayleigh wave incident on a surface indentation crack has been measured as the sample is stressed to fracture. The acoustic measurements have been correlated with the stable crack extension that precedes final failure. The crack extension behavior of as-indented specimens was found to differ appreciably from that of annealed specimens. Cracks in the annealed samples exhibited partial crack tip closure, but little stable extension, whereas cracks in the as-indented samples displayed both crack closure and irreversible crack growth. This behavior has been rationalized by invoking concepts based upon the residual stresses created by indentation.
    Type of Medium: Electronic Resource
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