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A critical appraisal of the logarithmic rate law in thin-film formation during oxidation of copper and its alloys (1981)

Roy, S. K. ; Sircar, S. C.

Springer

Oxidation of metals 15 (1981), S. 9-20

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Details

ISSN: 1573-4889

Schlagwort(e): oxidation ; logarithmic law ; copper ; copper alloys ; activation energy

Quelle: Springer Online Journal Archives 1860-2000

Thema: Maschinenbau

Notizen: Abstract Investigations have been carried out on the kinetics of thin film formation of copper and its alloys in the temperature range of 75–100°C. The experimental results have been found to follow the logarithmic rate law except for the copper-chromium system at 100°C. The kinetic data have been analyzed in light of William and Hayfield's theory, and the various parameters of the logarithmic rate equation match very well to those calculated by others. The estimated activation energy value did not show significant variation. The major contribution to the rate of film growth has been ascribed to the available number of Fermi electrons.

Materialart: Digitale Medien

URL: http://dx.doi.org/10.1007/BF00603754

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