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A novel method of processing pulse echo data in adhesive bond inspection (1990)

Segal, E. ; Dickstein, P. ; Segal, Y. ; [et al.]

Springer

Journal of nondestructive evaluation 9 (1990), S. 1-17

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ISSN: 1573-4862

Keywords: Ulstrasonics ; adhesive bond ; higher order crossing (HOC) ; interface ; nondestructive testing

Source: Springer Online Journal Archives 1860-2000

Topics: Electrical Engineering, Measurement and Control Technology , Mathematics

Notes: Abstract A novel method for evaluating nondestructively the quality of bonded assemblies is presented. It is shown that a combination of HOC (higher order crossing) analysis and another frequency domain parameter can distinguish between different surface treatments, as well as predicting cohesive or adhesive failure of bonds. It is believed that this method will open the way to predict the durability of bonded structures at the manufacturing or inservice stages.

Type of Medium: Electronic Resource

URL: http://dx.doi.org/10.1007/BF00566978

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