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  • 1
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 5 (1965), S. 111-116 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: This article describes a simple and accurate method for measuring the reactivity and final cure state of epoxy resins. In the method, the reaction of a thin film of epoxy resin between two Nace plates is followed during a complete curing cycle. The method makes it possible to study effect of temperature and catalyst on cure rate, as well as comparing the equivalence of various materials. The techniques discussed in the article may be useful in the application of thermosetting resins other than epoxies.
    Additional Material: 11 Ill.
    Type of Medium: Electronic Resource
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