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  • 1
    Digitale Medien
    Digitale Medien
    Hoboken, NJ : Wiley-Blackwell
    AIChE Journal 28 (1982), S. 604-609 
    ISSN: 0001-1541
    Schlagwort(e): Chemistry ; Chemical Engineering
    Quelle: Wiley InterScience Backfile Collection 1832-2000
    Thema: Chemie und Pharmazie , Werkstoffwissenschaften, Fertigungsverfahren, Fertigung
    Notizen: A compact optical fiber probe to measure the velocity of solid particles in two-phase flows was constructed. The probe has been used to measure particle velocities and obtain flow trajectories of solids in the distributor grid region of a two-dimensional fluidized bed. Air was used as the fluidizing medium in a bed of glass beads of size ranging form 0.2 to 0.7 mm.Particle velocities were measured at corresponding points within a jet in the two-dimensional bed, using the optical fiber probe and a Laser Doppler Velocimeter (LDV). The probe measurements compare well with the LDV results in the main jet region. Particle velocities were also measured with the probe in the dense phase region of the fluidized bed where measurements were not possible using LDV. The resulting flow maps clearly indicate solids circulation patterns around jets and identify dead zones formed on the distributor plate.
    Zusätzliches Material: 10 Ill.
    Materialart: Digitale Medien
    Bibliothek Standort Signatur Band/Heft/Jahr Verfügbarkeit
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  • 2
    Digitale Medien
    Digitale Medien
    Hoboken, NJ : Wiley-Blackwell
    AIChE Journal 29 (1983), S. 443-451 
    ISSN: 0001-1541
    Schlagwort(e): Chemistry ; Chemical Engineering
    Quelle: Wiley InterScience Backfile Collection 1832-2000
    Thema: Chemie und Pharmazie , Werkstoffwissenschaften, Fertigungsverfahren, Fertigung
    Notizen: Cooling a tube-wall reactor using an annular heat pipe (AHP) is more temperature-stable, more flexible and more productive than cooling by conventional means. Tube-wall reactors cooled by an annular heat pipe arrangement exhibit flatter temperature profiles and uniform redistribution of the imposed heat load. The combination of tube-wall reactor and annular heat pipe is subject to the usual capacity limitations of the heat pipe: sonic flow, boiling heat transfer, liquid entrainment, and capillary flow of the working fluid.
    Zusätzliches Material: 10 Ill.
    Materialart: Digitale Medien
    Bibliothek Standort Signatur Band/Heft/Jahr Verfügbarkeit
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  • 3
    Digitale Medien
    Digitale Medien
    Hoboken, NJ : Wiley-Blackwell
    AIChE Journal 29 (1983), S. 383-388 
    ISSN: 0001-1541
    Schlagwort(e): Chemistry ; Chemical Engineering
    Quelle: Wiley InterScience Backfile Collection 1832-2000
    Thema: Chemie und Pharmazie , Werkstoffwissenschaften, Fertigungsverfahren, Fertigung
    Notizen: The bubble eruption process was studied in two- and three-dimensional (2D and 3D) beds using a high-speed video system for flow visualization. The results show the existence of four different ejection mechanisms; one occurring with singlebubble eruptions in both 2D and 3D beds, two others occurring in 2D and 3D beds with two bubbles coalescing at the bed-free surface, and the fourth occurring only in 3D beds with bubbles coalescing at the bed surface.
    Zusätzliches Material: 11 Ill.
    Materialart: Digitale Medien
    Bibliothek Standort Signatur Band/Heft/Jahr Verfügbarkeit
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  • 4
    Digitale Medien
    Digitale Medien
    Hoboken, NJ : Wiley-Blackwell
    AIChE Journal 33 (1987), S. 1187-1196 
    ISSN: 0001-1541
    Schlagwort(e): Chemistry ; Chemical Engineering
    Quelle: Wiley InterScience Backfile Collection 1832-2000
    Thema: Chemie und Pharmazie , Werkstoffwissenschaften, Fertigungsverfahren, Fertigung
    Notizen: A model including the effects of diffusion and convection can be used to predict the etch rate of crystalline silicon in a plasma discharge of nitrogen trifluoride. The case of a radial flow reactor with crystalline silicon wafers located at discrete positions can be solved using a finite-element solution to a boundary value problem. Such a model is useful to predict the effects of pressure, flow rate of etchant gas, percent silicon exposed, and wafer position on both inter-and intrawafer etch rates. It was found from modeling that greater uniformity in etch rate is achieved by lowering the pressure and percent exposure of silicon, and to a lesser degree the volumetric flow rate.
    Zusätzliches Material: 16 Ill.
    Materialart: Digitale Medien
    Bibliothek Standort Signatur Band/Heft/Jahr Verfügbarkeit
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