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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 78 (1995), S. 6241-6248 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Epitaxial growth of erbium-doped silicon films has been performed by plasma-enhanced chemical vapor deposition using an electron-cyclotron-resonance source. The goal was to incorporate erbium as an optically active center (ErO6) through the use of metal-organic dopant sources. The characteristic 1.5 μm emission was observed by photoluminescence. Chemical analysis of the film revealed, however, that the organic ligands were decomposing and contributing to the carbon contamination of the films. Analysis of the molecular flux to the substrate indicated that the metal-organic compound used, tris(2,2,6,6-tetramethyl-3-5-heptanedionato)erbium(III), was most likely to decompose, and supply unbonded atomic erbium and not the optical active species, ErO6. Excessive carbon contamination lowered epitaxial quality and reduced the photoluminescent intensity. Photoluminescent intensity was improved by a 600 °C anneal but was strongly quenched by a 900 °C anneal. The low-temperature anneal improved crystal quality, and the high-temperature anneal resulted in silicide formation. © 1995 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 80 (1996), S. 551-558 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Epitaxial growth of Er-doped silicon films has been performed by plasma-enhanced chemical vapor deposition at low temperature (430 °C) using an electron cyclotron resonance source. The goal was to incorporate an optically active center, erbium surrounded by nitrogen, through the use of the metalorganic compound tris (bis trimethyl silyl amido) erbium. Films were analyzed by Rutherford backscattering spectrometry, secondary ion mass spectroscopy, and high resolution x-ray diffraction. The characteristic 1.54 μm emission was observed by photoluminescence spectroscopy. Previous attempts to incorporate the complex (ErO6) using tris (2,2,6,6-tetramethyl- 3,5-heptanedionato) erbium (III) indicated that excessive carbon contamination lowered epitaxial quality and reduced photoluminescent intensity. In this study, chemical analysis of the films also revealed a large carbon concentration, however, the effect on epitaxial quality was much less destructive. A factorial design experiment was performed whose analysis identified the key processing parameters leading to high quality luminescent films. Hydrogen was found to be a major cause of crystal quality degradation in our metalorganic plasma-enhanced process. © 1996 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 67 (1995), S. 971-973 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Epitaxial Si films have been deposited at low substrate temperatures of 400 and 500 °C, by plasma enhanced chemical vapor deposition using an electron cyclotron resonance source. Samples were analyzed using Rutherford backscatter spectrometry, cross-sectional transmission electron microscopy, and x-ray diffraction. The ion-to-adatom arrival ratio was found to be an important parameter in determining epitaxial film quality. This ratio was controlled by the SiH4 feed rate, microwave power level, and shape of the magnetic field in the substrate region. Incident ion energy and ion flux were monitored with a gridded energy analyzer located at the substrate location. © 1995 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 68 (1996), S. 349-351 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The limiting epitaxial thickness of Si films grown at a low substrate temperature by plasma enhanced chemical vapor deposition has been determined. The specific process used was electron cyclotron resonance plasma deposition. The limiting epitaxial thickness was found to decrease with the ratio of energetic ion-to-adatom arrivals on the substrate surface. The measured epitaxial thicknesses are similar to those obtained in previous investigations using molecular beam epitaxy. Hydrogen surface coverage does not appear to be a factor in limiting epitaxial thickness. The maximum epitaxial thickness remains to be determined for this process and substrate temperature range. © 1996 American Institute of Physics.
    Type of Medium: Electronic Resource
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