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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 72 (1992), S. 3169-3178 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: This article investigates the epitaxial regrowth of n-type and p-type polycrystalline silicon (polysilicon) layers deposited on silicon, which are subjected to either a single emitter diffusion or consecutive base and emitter diffusions. A wide range of diffusion conditions is considered, covering both rapid thermal and furnace diffusion in the temperature range 950–1200 °C. The sheet resistances of single-diffused n-type polysilicon layers are significantly higher than those of double diffused layers for rapid-thermal emitter diffusions in the temperature range 1025–1125 °C. This is explained by the epitaxial regrowth of the polysilicon during the emitter diffusion, caused by the partial break-up of the interfacial oxide during the base diffusion. In contrast the sheet resistances of single- and double-diffused p-type polysilicon layers are found to be similar. Rutherford backscattering spectra are presented which show that the structures of the single- and double-diffused polysilicon layers are similar. This is explained by the effect which fluorine, incorporated into the polysilicon during the BF2 emitter implant, has in accelerating the break-up of the interfacial oxide during the early part of the emitter diffusion. Estimates are made of the time to break up the interfacial oxide layer and the time to vertically epitaxially align the polysilicon at different temperatures, and activation energies of 4.9 and 4.7 eV, respectively obtained. In n-type polysilicon, the epitaxial regrowth is dominated by the time to break up the interfacial oxide layer, whereas in BF2 implanted p-type polysilicon it is dominated by the time to vertically epitaxially align the polysilicon. A vertical epitaxial alignment rate of 1000 A(ring)/s is obtained for n-type polysilicon at 1050 °C, compared with 240 A(ring)/s for p-type polysilicon at 1100 °C.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 90 (2001), S. 6182-6189 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A comparison is made of the electrical effects of carbon in n- and p-type in situ doped polycrystalline Si1−yCy and Si0.82−yGe0.18Cy layers. Values of resistivity as a function of temperature, effective carrier concentration and Hall mobility are reported. The n-type polycrystalline Si1−yCy and Si0.82−yGe0.18Cy films show dramatic increases in resistivity with carbon content, rising from 0.044 Ω cm to 450 Ω cm (0 and 0.8% C) and 0.01 Ω cm to 2.4 Ω cm (0 and 0.6% C), respectively. In contrast, the increase in B-doped films is much less severe, rising from 0.001 Ω cm to 0.939 Ω cm (0 and 7.9% C) and 0.003 Ω cm to 0.015 Ω cm (0 and 4% C) for the Si1−yCy and Si0.82−yGe0.18Cy layers, respectively. The grain boundary energy barrier, determined from the temperature dependence of the resistivity, is found to vary as the square of the C content in the n-type polycrystalline Si1−yCy and Si0.82−yGe0.18Cy layers, but linearly in the p-type Si1−yCy layers. The square law dependence seen in the n-type layers for C contents up to 0.9% is explained by an increase in the grain boundary trap density due to the presence of carbon, whereas the linear relationship seen in the p-type layers for C contents between 2% and 8% is explained by a shift in the grain boundary trap energy toward the valence band. Finally, lower values of grain boundary energy barrier are obtained in p-type Si0.82−yGe0.18Cy layers with a C content of 4% than in equivalent Si1−yCy layers, which could be explained by a larger shift in trap energy toward the valence band. © 2001 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 3
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A comparison is made of the dc electrical characteristics of Si/Si1−xGex heterojunction bipolar transistors (HBTs) fabricated on high oxygen content material grown using molecular beam epitaxy and low oxygen content material grown using chemical vapor deposition. The base currents of Si/Si0.85Ge0.15 HBTs with a high oxygen content are significantly higher than those of comparable devices with a low oxygen content and the base currents of both are higher than those of silicon homojunction devices. In addition the base current in the low oxygen content devices increases significantly when the germanium concentration is increased from 15% to 23%. The roles of the lifetime in the base and the out-diffusion of the boron from the Si1−xGex base are investigated using a two-dimensional drift-diffusion device simulator. It is shown that the increased base currents in the HBTs are caused by recombination in the neutral base, and that the lifetime in the Si1−xGex is an important parameter in determining the base current. Modelling of the measured base currents indicates that the lifetime in the high oxygen content Si0.85Ge0.15 is reduced by a factor of approximately 15 compared with silicon, but in the low oxygen content Si0.77Ge0.23 by a smaller factor of approximately 4. Boron out-diffusion from the base is present in both the high and low oxygen content HBTs, but it appears to be significantly less in the former. A high oxygen content in Si1−xGex HBTs therefore has the disadvantage of decreasing the lifetime, but the advantage of decreasing the boron out-diffusion from the base. © 1995 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 4
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A comparison is made between the results of high-resolution electron microscope observations and the electrical characteristics of polycrystalline silicon emitter bipolar transistors. Devices are fabricated with and without a deliberately grown interfacial oxide layer, and the thermal stability of this oxide layer is investigated by carrying out a preanneal at temperatures between 800 and 1100 °C after polysilicon deposition, but prior to emitter implant and 900 °C drive-in. The electron microscope observations show that the deliberately grown interfacial oxide is of uniform thickness ∼14 A(ring), but breaks up when annealed at ∼950 °C and above, with "balling-up'' occurring at ∼1100 °C. This correlates with a transistor gain that decreases from ∼1400 to ∼40. The electron microscopy also shows that a thin interfacial oxide layer is present even when not deliberately grown. This oxide breaks up when annealed at ∼900 °C and above, with "balling-up'' occurring at ∼1000 °C. This correlates with a transistor gain that decreases from ∼240 to ∼50. Calculations of the effect that such interfacial oxide layers will have on the characteristics of polysilicon emitter bipolar transistors are made, and these predictions correlate well with the measured characteristics.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 66 (1995), S. 1918-1920 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A study is made of fluorine implantation into n+ polycrystalline silicon (polysilicon), with the aim of producing completely epitaxially regrown polysilicon emitters at lower temperatures. Polysilicon-on-silicon sheet resistance measurements are made to obtain an indication of the amount of polysilicon regrowth, and cross-section transmission electron microscope examinations to directly observe the regrowth. Samples given a fluorine implant, followed by a 1000 °C/10 min preanneal, show 50% epitaxial regrowth of the polysilicon after an emitter drive-in of only 850 °C/30 min. In contrast, in the absence of fluorine, negligible regrowth occurs even after an emitter drive-in of 850 °C/480 min. © 1995 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 77 (2000), S. 561-563 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The sheet resistance, effective carrier concentration, and Hall mobility of in situ boron- and phosphorus-doped polycrystalline Si0.82−yGe0.18Cy films are presented for carbon contents between 0% and 4%. Phosphorus and boron doping levels of 4×1019 and 2×1020 cm−3 were achieved for the n- and p-type layers, respectively, and remained largely unaffected by carbon content. The phosphorus-doped films showed a dramatic increase in sheet resistivity and a corresponding drop in effective carrier concentration and Hall mobility. In contrast, the boron-doped films showed only a minor increase in resistivity. This is attributed to interstitial carbon increasing the defect density and also shifting the defect energy levels at the grain boundaries towards the valence band. This causes an increase in the grain-boundary energy barrier in n-type layers, but leaves the p-type layers largely unaffected. © 2000 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 7
    Electronic Resource
    Electronic Resource
    Amsterdam : Elsevier
    Solid State Electronics 18 (1975), S. 491-497 
    ISSN: 0038-1101
    Source: Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
    Topics: Electrical Engineering, Measurement and Control Technology , Physics
    Type of Medium: Electronic Resource
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  • 8
    Electronic Resource
    Electronic Resource
    Amsterdam : Elsevier
    Solid State Electronics 17 (1974), S. 689-698 
    ISSN: 0038-1101
    Source: Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
    Topics: Electrical Engineering, Measurement and Control Technology , Physics
    Type of Medium: Electronic Resource
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  • 9
    Electronic Resource
    Electronic Resource
    Amsterdam : Elsevier
    Solid State Electronics 33 (1990), S. 753-755 
    ISSN: 0038-1101
    Source: Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
    Topics: Electrical Engineering, Measurement and Control Technology , Physics
    Type of Medium: Electronic Resource
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  • 10
    Electronic Resource
    Electronic Resource
    Amsterdam : Elsevier
    Solid State Electronics 20 (1977), S. 731-740 
    ISSN: 0038-1101
    Source: Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
    Topics: Electrical Engineering, Measurement and Control Technology , Physics
    Type of Medium: Electronic Resource
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