Library

X
feed icon rss

Your email was sent successfully. Check your inbox.

An error occurred while sending the email. Please try again.

Proceed reservation?

Export
  • 1
    Electronic Resource
    Electronic Resource
    Fermi level position at metal Si1−x−yGexCy interfaces (2001)
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 89 (2001), S. 5533-5542 
    Details
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: In this work, we have investigated the Schottky barrier heights on n- and p-type Si1−x−yGexCy alloys with Zr, Ti, W, Ni and Pt as metals (ΦBn and ΦBp, respectively). Contacts on Si1−xGex alloys showed various behaviors depending on the metal work function Φm. For low-Φm metals (Zr, Ti), ΦBn increases with x, while ΦBp(x) decreases. For higher Φm metals (Pt), ΦBn strongly decreases with x. In the particular case of W (intermediate Φm value), ΦBp follows exactly the decrease of the SiGe band gap with x, while ΦBn remains constant. Nevertheless, whatever the metal, the reduction of the sum ΦBn+ΦBp gives the band-gap variation as a function of x, and the Fermi level is located at the same position for both n and p-type layers. A weaker effect of Φm on the Schottky barrier heights is observed compared to pure Si: the position of the Fermi level tends to remain in the range 0.60–0.65 eV below the conduction band, as soon as Ge is adding in Si. W contacts on Si1−x−yGexCy alloys evidenced the strong effect of C on ΦBn and ΦBp. The variations of ΦBn(y) or ΦBp(y) cannot be correlated to the band gap. In addition, the position of the Fermi level at the interface depends on the type of the alloy. Nevertheless, as in the case of the binary alloy SiGe, a weaker dependence on Φm compared to that observed for pure Si is shown. High values of the ideality factor with increasing the C content may evidence the presence of interfacial inhomogeneities, which could be correlated to C short range order. The present results have been compared to existing published results. © 2001 American Institute of Physics.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.1365943
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 2
    Electronic Resource
    Electronic Resource
    Phase formation and strain relaxation during thermal reaction of Zr and Ti with strained Si1−x−yGexCy epilayers (2000)
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 88 (2000), S. 1418-1423 
    Details
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Silicides are often used in Si technology for both their ohmic and rectifying properties. In this work, we have compared Zr and Ti germanosilicides as possible metallic contacts on SiGeC alloys in terms of phase formation and stability of the unreacted SiGeC alloy. The germanosilicides are obtained after rapid thermal annealings of Zr or Ti with strained SiGeC layers. The interactions of the metal films with these alloys have been investigated by sheet resistance measurements, x-ray diffraction (XRD), cross-sectional transmission electron microscopy (TEM), and energy dispersive spectroscopy in situ in the TEM. Four crystal x-ray diffraction was performed to measure the residual strain of the unreacted SiGeC epilayer after reaction. The analyses indicate that the final compounds are the C49–Zr(SiGe)2 and C54–Ti(SiGe)2 phases, respectively: In both cases, the compound is formed by monocrystalline grains with various orientations. Nevertheless, neither XRD, nor sheet resistance measurements give any clear information about the C incorporation in the phase, when the reaction occurs with a SiGeC layer. We have observed that the use of Zr completely avoids Ge segregation with an uniform layer formed, while in the case of the reaction with Ti, the grains do not form a continuous layer and Ge-segregation is evidenced: A Ge-rich Si1−z−yGez(Cy) alloy is detected in between the metallic grains. In addition, an early strain relaxation of the unreacted SiGe layer is observed after reaction, and it is much more important after reaction with Ti. During the reaction with nearly compensated SiGeC layers, Zr totally prevents the initial state of strain, while Ti strongly affects the unreacted SiGeC alloy and destroys its initial state. All these results indicate that Zr may be an interesting candidate for realizing germanosilicide contacts on IV–IV alloys, due to its good thermal stability. © 2000 American Institute of Physics.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.373833
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 3
    Electronic Resource
    Electronic Resource
    Structural properties and stability of Zr and Ti germanosilicides formed by rapid thermal annealing (2002)
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 91 (2002), S. 5468-5473 
    Details
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Because of their good ohmic and rectifying properties, silicides are routinely used in Si technology. This approach has been recently extended to the novel devices produced using Si1−xGex alloys. Here, we study the Zr and Ti germanosilicides produced in the low thermal budget contact formation during Si/Si1−xGex heterodevice processing. Phase formation was monitored by combining a range of spectrometries with electron microscopy and x-ray diffraction techniques, while sheet resistance measurements allowed correlation of phase formation with film conductance. After completion of the reaction, the final crystalline phase was either C49–Zr(Si1−yGey)2 in the entire Ge composition (x) range, or C54–Ti(Si1−yGey)2 in the Ge composition range 0–0.47. In the Zr–Si–Ge system, the C49–Zr(Si1−yGey)2 formation temperature (Tf) decreases as x increases, and films formed at this temperature are continuous. Excess heating (above Tf) produces islanded films with embedded grains. A most significant feature of the results was that no Ge segregation was detected at any annealing temperature and that the Ge content in the C49 phase (y) remained equal to x for all x. This is in contrast to results on the C54–Ti(Si1−yGey)2 films, which were discontinuous when x〉0.10, and in which Ge segregation occurred in the form of Ge-rich SiGe decorations separating the germanosilicide grains. The Ge content in the final C54 phase (y) was always lower than the value of x in the initial SiGe alloy, and the measured sheet resistance of the corresponding contacts was large. Our results indicate that the alloys formed between Zr and Si1−xGex are good candidates as stable contacts on Si1−xGex, and hence that Zr should be preferred for contacting in Ge-rich SiGe-based applications. © 2002 American Institute of Physics.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.1462855
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 4
    Electronic Resource
    Electronic Resource
    Thermal stability and electrical properties of Zr/Si1−x−yGexCy contacts after rapid thermal annealing (1998)
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 73 (1998), S. 1248-1250 
    Details
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: In this work, we have investigated the reaction between Zr and SiGeC alloys. Annealings have been performed in a rapid thermal annealing (RTA) furnace at temperatures ranging from 400 to 800 °C for 5 min. The reaction of the metal with the alloy has been investigated by x-ray diffraction and Rutherford backscattering spectrometry. Four crystal x-ray diffraction was performed to measure the residual strain in the epilayer. The analyses indicate that the C49-Zr(Si1−xGex)2 is the final phase of the reaction. For all compositions examined (from 0% up to 33% of Ge), the C49 film has the same Ge content as in the as-deposited Si1−x−yGexCy layer and no Ge segregation has occured. In addition, this thermal treatment leads to only a small strain relaxation in the unreacted epilayer. The presence of C does not modify the reaction and it prevents any strain relaxation. Schottky barrier height measurements have been performed on p-type layers. RTA leads to a slight decrease of the barrier without any degradation of the contact. The C49 film presents a resistivity of about 80 μΩ cm. These results indicate that Zr may be a good candidate for contacts on IV–IV alloys in terms of thermal stability. © 1998 American Institute of Physics.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.122141
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
Close ⊗
This website uses cookies and the analysis tool Matomo. More information can be found here...