ISSN:
0954-0911
Source:
Emerald Fulltext Archive Database 1994-2005
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
The assembly of surface mounted component parts into 3-dimensional moulded circuit boardsenables the integration of electronic and mechanical functions. However, this requires theassembly processes to be adapted to the MID's 3-dimensional geometry. This paper describesresearch on the development of assembly systems for MIDs at the FAPS Institute. Limits on theapplication of solder paste on inclined process planes are discussed, as well as possibilities ofassembling with conventional assembly systems. A possibility for adapting existing assembly systemsto new requirements is demonstrated and a concept for an optimised MID assembly system will begiven.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1108/09540919610777564
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