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  • 1
    Electronic Resource
    Electronic Resource
    s.l. : American Chemical Society
    The @journal of organic chemistry 26 (1961), S. 929-931 
    ISSN: 1520-6904
    Source: ACS Legacy Archives
    Topics: Chemistry and Pharmacology
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Applied Polymer Science 11 (1967), S. 2109-2120 
    ISSN: 0021-8995
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Phenyltris(methylamino)silane, phenyltris(ethylamino)silane, and vinyltris(hexylamino)silane were synthesized and evaluated as curing agents for epoxy resins. Cured resins derived therefrom have very good physical and dielectric properties. The moisture resistance of the resins evaluated was especially good for those derived from the vinyltris(hexylamino)silane. Typical dielectric properties of a phenyltris(ethylamino)silane-cured epoxy specimen include a dielectric constant of 3.7 at 25°C. and a dissipation factor of 0.8%. Elevated temperature data are also presented.
    Additional Material: 5 Ill.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    New York : Wiley-Blackwell
    Journal of Polymer Science: Polymer Chemistry Edition 21 (1983), S. 3009-3026 
    ISSN: 0360-6376
    Keywords: Physics ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Notes: Three diethynylated bisbenzimidazole prepolymers were synthesized and their polymerization characteristics examined. N-phenyl-substituted diethynylated bisbenzimidazoles melted between 250 and 265°C and had gel times of several seconds to several minutes. In contrast, an N-phenoxyphenyl diethynylated bisbenzimidazole melted at a temperature sufficiently low (ca. 150°C) to provide a 5-min gel time at 170°C and a 4-min gel time at 210°C. This material showed promise as a potential laminating resin and a brief screening of the prepolymer for this application was carried out. The polymers of both N-phenyl- and N-phenoxyphenyl-substituted diethynylated bisbenzimidazoles showed apparent degradation temperatures of 500°C or greater when examined by thermogravimetric analysis.
    Additional Material: 2 Ill.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    New York : Wiley-Blackwell
    Journal of Polymer Science Part A-1: Polymer Chemistry 5 (1967), S. 2595-2615 
    ISSN: 0449-296X
    Keywords: Physics ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Notes: 1,3-Bis[p-(2,3-epoxypropyl)phenyl]tetramethyldisiloxane and its meta isomer were synthesized and subsequently cured with m-phenylenediamine. Dielectric properties of the cured resin derived from the para isomer were measured between 25 and 100°C. The ambient temperature dielectric constant of the resin at 1 kc./sec. was 3.4, its dissipation factor was 0.01, and its volume resistivity was 1014 ohm-cm. at 500 v. d.c. Several allylphenylsiloxanes were also prepared by the cohydrolysis of allylphenyldimethylethoxysilane with dimethyldiethoxysilane, bis(dimethylethoxysilyl)benzene, and methyltriethoxysilane. Preliminary epoxidation studies on these latter materials were also carried out.
    Additional Material: 5 Ill.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    New York : Wiley-Blackwell
    Journal of Polymer Science Part A-1: Polymer Chemistry 7 (1969), S. 2689-2705 
    ISSN: 0449-296X
    Keywords: Physics ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Notes: Ferrocene has been copolymerized with terephthalaldehyde and 1,1′-ferrocenedicarboxaldehyde to produce thermosetting polymers suitable for the fabrication of reinforced structural composites. Both the terephthalaldehyde and 1,1′-ferrocenedicarboxaldehyde were also found to be useful curing agents for polyferrocenylenes formed by other methods. Glass-reinforced laminates have been fabricated from both types of copolymers and from both types of cured polyferrocenylenes. Laminate flexural strengths have been in the range of 35 000 psi.
    Additional Material: 2 Ill.
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    New York : Wiley-Blackwell
    Journal of Polymer Science Part A-1: Polymer Chemistry 7 (1969), S. 2719-2736 
    ISSN: 0449-296X
    Keywords: Physics ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Notes: Polyferrocenylenes with mean molecular weights of 500-4 000 have been converted into thermosetting polymers by reaction with xylylene glycol and telomers thereof. The prepolymers have been used successfully as molding materials and laminating resins. Glass fiber-reinforced laminates have been made with flexural strengths of 63 × 103 psi and flexural moduli of 4-5 × 106 psi. Ferrocene-xylylene glycol copolymers were also prepared, and 1,1′-bis(hydroxymethyl)ferrocene was used as a polyferrocenylene crosslinking agent. Laminates were also made from the 1,1′-bis(hydroxymethyl)ferrocene-based polymers.
    Additional Material: 1 Ill.
    Type of Medium: Electronic Resource
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