ISSN:
1042-7147
Keywords:
epoxy resin
;
phase-separated blend
;
polyimide powder
;
polyamide powder
;
fracture toughness
;
Chemistry
;
Polymer and Materials Science
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
A series of hot-melt processable thermosetting compositions was prepared by blending N,N,N′,N′-tetraglycidyl-4,4′ -diaminodiphenyl-methane/4,4′-diaminodiphenylsulfone (TGMDA/DDS) epoxy resin and thermoplastic polymer powders with average particle size below 30 μm. The basic thermoplastic polymers were either a high Tg amorphous cardo polyimide (Tg=350°C) or commercial semicrystalline PA6 and PA12 polyamides. The resulting heterogeneous mixtures showed viscosity values below 5000 cps suitable for prepregging process. After cure, phase-separated morphologies were maintained with a rather limited interphase miscibility as demonstrated by thermomechanical analysis. Scanning electron microscope examination of fracture surfaces pointed out a strong adhesion between the powder particles and the surrounding polyepoxy network, particularly for the potentially reactive polyamide structures. Moreover, as shown by differential scanning calorimeter analysis, the crystallinity ratio of the PA6 and PA12 powders was lowered due to melting during thermal polymerization. The fracture toughness properties of the powder-containing materials were compared with those of a fully miscible cardo polyimide-TGMDA/DDS blend coming from an homogeneous resin composition. The best improvement in fracture energy was obtained for the powder-modified resins. The most effective composition filled with 16 wt% of powdered polyimide exhibited a fourfold increase in GIC (388 J/m2 versus 100 J/m2) without compromising the epoxy thermomechanical stability (Tg=227°C versus 223°C).
Additional Material:
7 Ill.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/pat.1995.220060401
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