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  • 1
    Electronic Resource
    Electronic Resource
    Processable polyisoimide polymer blends for application as thermally stable adhesives for composites and advanced metal alloys (1991)
    New York, NY : Wiley-Blackwell
    Polymers for Advanced Technologies 2 (1991), S. 81-86 
    Details
    ISSN: 1042-7147
    Keywords: Polyisoimides ; Polymer blends ; Scrim cloth ; Adhesive bonding ; Lap shear strength ; Oligomeric polyimides ; Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Polyimides are effective thermally stable bonding agents for substrates including titanium, aluminum alloys, steel alloys, metal matrix composites, and polymer/fiber composites with good tolerance toward elevated temperature and humidity.Problems associated with polyimide adhesives, including high processing temperatures and pressures and high melt viscosity, can be partially or totally alleviated by use of blends of polyisoimides. During thermal processing, the polyisoimides are isomerized to their polyimide modifications.
    Additional Material: 1 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pat.1991.220020205
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  • 2
    Electronic Resource
    Electronic Resource
    Ethynylated N-phenylbenzimidazoles: Synthesis and thermal properties (1983)
    New York : Wiley-Blackwell
    Journal of Polymer Science: Polymer Chemistry Edition 21 (1983), S. 3009-3026 
    Details
    ISSN: 0360-6376
    Keywords: Physics ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Notes: Three diethynylated bisbenzimidazole prepolymers were synthesized and their polymerization characteristics examined. N-phenyl-substituted diethynylated bisbenzimidazoles melted between 250 and 265°C and had gel times of several seconds to several minutes. In contrast, an N-phenoxyphenyl diethynylated bisbenzimidazole melted at a temperature sufficiently low (ca. 150°C) to provide a 5-min gel time at 170°C and a 4-min gel time at 210°C. This material showed promise as a potential laminating resin and a brief screening of the prepolymer for this application was carried out. The polymers of both N-phenyl- and N-phenoxyphenyl-substituted diethynylated bisbenzimidazoles showed apparent degradation temperatures of 500°C or greater when examined by thermogravimetric analysis.
    Additional Material: 2 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pol.1983.170211016
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    Paper (German National Licenses)
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