ISSN:
1436-2449
Source:
Springer Online Journal Archives 1860-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
Summary The low temperature relaxation of epoxy resin modified with siloxane oligomers was investigated by using thermally stimulated current (TSC) and relaxation map analysis (RMA). The β-relaxation of epoxy resin and the glass transition temperature of siloxane oligomer were folded and shifted to higher temperature as the concentration of trifluoropropyl (TFP) in siloxane oligomer increased. In the systems containing over 50% of TFP a new relaxation peak due to the dipole orientation was observed at around-45°C. As the concentration of TFP increased the compensation temperature (Tc) and the degree-of-disorder (DOD) were increased while the compensation time, τc was decreased.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/BF00324120
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