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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 73 (1993), S. 7129-7137 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Boundary problems for a circular insert bonded partially to the interior of an infinite medium of another material under an uniform heat flow are formulated and solved in closed form. The unbonded portions of the interface may be regarded as circular arcs of discontinuities or curved cracks. By application of the complex function theory dealing with sectionally holomorphic functions, the present problem is reduced to the solution of the problem of linear relationship or Hilbert problem. Exact solution is given for an example of a single circular-arc crack. It is found that the temperature gradients or heat flux near the tips of a curved crack possess the characteristic inverse square-root singularity in terms of the radial distance away from the crack tip which is the same as those obtained for a straight crack between dissimilar materials. Due to this singular behavior, the heat flux intensity factor is introduced to measure the thermal energy intensification cumulated in the vicinity of the crack tip. Numerical results for the temperature and heat flux intensity factor are provided in graphic forms. It is shown that the material of a circular insert having a lower heat conductivity would make the heat flux intensity factor smaller. Consequently, the thermal energy intensification is diminished.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 74 (1993), S. 7085-7093 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A general solution to the hygrothermoelastic problem associated with an interface discontinuity between dissimilar anisotropic media is presented. The complex variable representation of Lekhnitskii [Theory of Elasticity of an Anisotropic Elastic Body (Holden-Day, San Francisco, CA, 1963)] is extended into the hygrothermoelastic problem by means of five complex functions including three stress functions, one temperature function, and one moisture function. A special technique of analytical continuation is used to deal with the continuous conditions of dissimilar media. Based on the Hilbert problem formulation, the linear relation between the boundaries of discontinuity can be derived into a type of Cauchy integral, which makes the solution in a compact version. The result shows that the heat or moisture flux exhibits an inverse square-root singularity at the tips of discontinuity while the nature of singularity of the hygrothermal stresses possess the same trig-log character as those obtained for the elastic problem.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 72 (1992), S. 2598-2604 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The fundamental nature of an interface crack between dissimilar anisotropic media under the uniform heat flux is studied. Based on the Hilbert problem formulation and a special technique of analytical continuation, a simple and compact version of general solutions for the thermal field are given. The temperature gradients or heat fluxes are found to possess the characteristic inverse square-root singularity in terms of the radial distance from the crack tip. Due to this singular behavior, the heat flux intensity factor is then introduced to quantify the thermal energy cumulated in the neighborhood of the crack tip. Some numerical examples are given for the application of the final results to the intensity factor of heat flux as well as the full field solutions of temperature. It is very interesting to see that the solutions associated with the dissimilar media can be easily obtained from the corresponding problem associated with the homogeneous media by a simple substitution of their own material properties. In general, the system possesses the symmetric properties of the thermal conductivity coefficients which can make the heat flux intensity factor smaller. Consequently, the thermal energy intensification is diminished.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Physics of Plasmas 7 (2000), S. 101-107 
    ISSN: 1089-7674
    Source: AIP Digital Archive
    Topics: Physics
    Notes: One of the Ionospheric Plasma and Electrodynamics Instrument (IPEI) payload onboard the Republic of China satellite 1 (ROCSAT-1) spacecraft is a Retarding Potential Analyzer (RPA) to measure the ionospheric plasma composition, temperature, and the ram velocity of the flow. A three-dimensional computer model has been developed to simulate the ion and electron motions inside the RPA of the IPEI payload. The dynamical changes in the charged particles' motions corresponding to different electric potential profiles inside the RPA detector resulted in some distinctive measuring characteristics of the RPA detector, which show discrepancies in the measured of currents at the collector plate between the analytical model and the computer simulation. The important discoveries in the computer model are: (a) Ion transparency cannot be represented by the physical grid sizes in the detector. The alignments of the grid wires will also affect the ion transparency. The grid planes should be aligned for the maximum optical transparency to detect light ion fluxes. (b) Cut-off energy for protons is not as sharp as indicated in the analytical model. The contamination in the collector current from lighter ion species is possible. (c) Electron contamination at the collector plate is noticed if the mesh sizes are larger than the electron Debye length. © 2000 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    Amsterdam : Elsevier
    Journal of Nutritional Biochemistry 1 (1990), S. 89-97 
    ISSN: 0955-2863
    Keywords: Streptococcus sanguis I ; choline ; dimethylnitrosamine ; oral bacteria ; trimethylamine
    Source: Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
    Topics: Agriculture, Forestry, Horticulture, Fishery, Domestic Science, Nutrition
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    Springer
    International journal of fracture 75 (1995), S. 229-245 
    ISSN: 1573-2673
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract The antiplane interaction problem for an anisotropic elastic inclusion embedded in an anisotropic elastic matrix with an arbitrarily oriented crack, located either in the matrix or in the inclusion, is considered in this paper. The proposed analysis is based upon the use of conformal mapping, analytical continuation and Laurent series expansion of the corresponding complex potentials. By applying the existing solutions for dislocation functions, the integral equations for a line crack are formulated and the mode-III stress intensity factors are obtained numerically. Several numerical examples are given to demonstrate the effects of geometrical parameters and material property combinations on the strength of the antiplane stress singularity.
    Type of Medium: Electronic Resource
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  • 7
    Electronic Resource
    Electronic Resource
    Springer
    International journal of fracture 65 (1994), S. 1-18 
    ISSN: 1573-2673
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract A general solution to the elastic and thermoelastic problems with a rigid circular-arc inclusion is presented. The proposed analysis is based upon the complex variable theory dealing with sectionally holomorphic functions which is reduced to the solution of the Hilbert problem. It is indicated that both the stress and thermal stress fields near the inclusion tip possess a square-root singularity similar to that for the corresponding crack problem. In analogy to the stress intensity factors defined for crack problem, stress singularity coefficients are introduced in this paper to characterize the near tip fields. Complete stress fields and the corresponding stress singularity coefficients as the circular-arc inclusion are under uniform remote load, concentrated force and uniform heat flux are given. Failure initiation of an infinite plate embedded with a rigid arc inclusion under different loading conditions is also discussed.
    Type of Medium: Electronic Resource
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  • 8
    Electronic Resource
    Electronic Resource
    Springer
    International journal of fracture 64 (1993), S. 179-190 
    ISSN: 1573-2673
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract A general solution to the antiplane problem of curvilinear cracks in bonded dissimilar materials is provided. The analysis is based upon the Hilbert problem formulation and the technique of analytical continuation. To illustrate the use of the present approach, detailed results are given for a single circular-arc crack lying along the interface between dissimilar materials. The expressions of the complex potentials are derived explicitly in both the unit disk and the surrounding medium. Both the stress intensity factors and contact stress are provided in an explicit form and the former are verified by comparison with existing ones. The effect of material and geometrical parameters upon the contact stress and stress intensity factors has also been discussed and shown in graphic form.
    Type of Medium: Electronic Resource
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