ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
In MEMS, packaging induced stress or stress induced structure deformation becomesincreasing concerns since it directly affects the performance of the device. The conventional MEMSSOI (silicon-on-insulator) gyroscope, packaged using the anodic bonding at the wafer level andEMC (epoxy molding compound) molding, has a deformation of MEMS structure caused bythermal expansion mismatch. Therefore we propose a packaged SiOG (Silicon On Glass) processtechnology and more robust spring design
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/52/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.326-328.529.pdf
Permalink