ISSN:
1573-482X
Source:
Springer Online Journal Archives 1860-2000
Topics:
Electrical Engineering, Measurement and Control Technology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Abstract The thermal stability of MoSi x Schottky contacts to GaAs has been studied. The contacts were analysed by Rutherford backscattering spectroscopy (RBS), X-ray diffraction (XRD), sheet resistance, and current-voltage measurements. We have studied MoSi x with the compositionsx=0, 0.3, 0.6, 1, and 2. The films were annealed at various temperatures up to 850°C. The thermal stability of the films is found to bex-dependent. The best composition for thermally stable Schottky contacts is Mo5Si3. Good Schottky characteristics were retained with annealing temperatures up to 850°C for 30 min.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/BF00695001
Permalink