ISSN:
1662-8985
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Subsurface residual stresses of tungsten films induced by Chemical Mechanical Polishing(CMP) processes were investigated by the Grazing Incident X-Ray Diffraction (GIXRD). Basis of theGIXRD measurement was introduced and the experiments were conducted for residual stress oftungsten film measurements. Experimental procedures of the GIXRD measurements were presented.The obtained residual stresses value of tungsten films from 800 nm to 400 nm varies from 1086.1 ±105.2 MPa to 1670.6±103.4 MPa prior and after CMP process
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/40/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.32.75.pdf
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