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  • 1
    Electronic Resource
    Electronic Resource
    Springer
    Journal of materials science 23 (1988), S. 2273-2280 
    ISSN: 1573-4803
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract A metallographic study of diffusion bonds between aluminium and copper has been made in order to further understanding of the mechanism of bond formation for joints between dissimilar metals that form intermediate phases or intermetallic compounds. A three-stage mechanistic model based upon sintering principles has been proposed to explain this kind of diffusion joint.
    Type of Medium: Electronic Resource
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  • 2
    ISSN: 1573-4803
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract The diffusion bonding of the Ti-Al-4V alloy at low temperature (850°C) has been studied. The principal objective of this investigation was the development of a diffusion bonding procedure suitable for Ti-6Al-4V alloy and capable of being used as part of a superplastic forming/diffusion bonding process. It was found that high-quality joints can be obtained by bonding at 850°C, with pressures of 4 MPa and times in the range 90–120 min. Mechanical properties of the joints were determined using cylindrical and plane test pieces. Tensile, shear and peeling tests were used to determine the strength of the joints. On bonding with the above conditions, the parent alloy strength was reached. Little reduction in these values was measured because the heat treatment was applied during bonding. A metallographic study by scanning electron microscopy and energy dispersive spectroscopy was performed to determinate the influence of the previous parameters on the microstructural changes that occur in the joint. Grain growth kinetics and ratio of bonding area were also studied. The results shows that a new method of diffusion bonding for Ti-6Al-4V alloy has been developed. This method can be carried out using lower bonding temperatures than in conventional processes.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    Springer
    Journal of materials science 8 (1989), S. 137-140 
    ISSN: 1573-4811
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
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