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  • 1
    Electronic Resource
    Electronic Resource
    Westerville, Ohio : American Ceramics Society
    Journal of the American Ceramic Society 86 (2003), S. 0 
    ISSN: 1551-2916
    Source: Blackwell Publishing Journal Backfiles 1879-2005
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: With the introduction of soft lithography and micromolding in capillaries, low-cost microfabrication with liquid materials has become possible. In this article, we demonstrate how to fabricate porous ceramic lines of 10 μm width and several millimeter length on silicon wafer substrates by using colloidal suspensions of tin oxide. Microchannels of poly(dimethylsiloxane) (PDMS) served as molds that were spontaneously filled owing to capillary forces with suspensions of 0.1–40 vol% solid loading. The resulting ceramic lines have a height of about 7 μm and therefore differ from the usual ceramic thin film coatings. The capillary filling characteristics were observed under the microscope, and the implications of rheology and suspension chemistry are discussed and evaluated. Using the same capillaries, even smaller lines (2–3 μm width) of powder particles could easily be prepared by adjusting only the solid content of the suspensions.
    Type of Medium: Electronic Resource
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